EP3SE80F780C2N

The EP3SE80F780C2N is an Intel Stratix® III E Field Programmable Gate Array (FPGA) offered in a 780-ball FCBGA package. It provides 80,000 logic elements, approximately 6.84 Mbits of embedded RAM, and 488 general-purpose I/O pins in a surface-mount form factor for commercial-temperature applications.

Designed for applications that require high logic capacity and significant on-chip memory, this commercial-grade device operates from 860 mV to 1.15 V and across a 0 °C to 85 °C temperature range. The device is RoHS compliant.

Key Features

• Core Logic 80,000 logic elements to implement complex digital designs with substantial logic density.
• Embedded Memory Approximately 6.84 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• I/O Capacity 488 I/O pins to support a wide range of system interfacing and parallel connectivity.
• Power Supply Range Operates from 860 mV to 1.15 V to match system core-voltage requirements.
• Package 780-BBGA FCBGA (supplier package listed as 780-FBGA, 29×29) in a surface-mount configuration for compact board integration.
• Operating Conditions Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance RoHS compliant for regulatory and environmental considerations.

Unique Advantages

• High logic capacity: 80,000 logic elements support large-scale digital logic integration and complex FPGA implementations.
• Substantial on-chip memory: Approximately 6.84 Mbits of embedded RAM reduces the need for external memory in many designs.
• Ample I/O resources: 488 I/O pins offer flexibility for parallel interfaces, multiple peripherals, and board-level routing.
• Compact FCBGA package: 780-ball FCBGA (29×29) enables a small PCB footprint while maintaining high pin count.
• Wide core-voltage support: 860 mV to 1.15 V operation accommodates varied power architectures.
• Commercial-grade and RoHS compliant: Suitable for mainstream electronic products with regulatory compliance for hazardous substances.

Why Choose EP3SE80F780C2N?

The EP3SE80F780C2N provides a combination of high logic density, substantial embedded memory, and a large I/O complement in a compact FCBGA package, making it a practical choice for designs that require significant on-chip resources within a commercial temperature range. Its RoHS compliance and surface-mount packaging support modern assembly and regulatory needs.

This device is well suited for engineering teams and procurement teams looking for a high-capacity Stratix® III E FPGA from Intel, offering scalability through on-chip resources and an integration profile designed to simplify board-level design and component selection.

Request a quote or submit a parts inquiry to obtain pricing, availability, and procurement details for the EP3SE80F780C2N.