EP3SE80F780C2G

The EP3SE80F780C2G is an Intel Stratix III family FPGA offering 80,000 logic elements and approximately 6.84 Mbits of embedded memory. It provides a high pin-count I/O interface with 488 user I/O pins in a 780-FBGA (29×29) surface-mount package, targeted for commercial temperature-operation systems.

Built on the Stratix III architecture, this device addresses high-performance logic, digital signal processing (DSP), and embedded system integration where reprogrammable, high-capacity logic and memory are required. Key technical advantages include a wide core voltage range (860 mV–1.15 V), on-chip memory resources, and family-level features for clocking, security, and reliability.

Key Features

• Logic Capacity  80,000 logic elements provide substantial programmable logic resources for complex control, signal processing, and protocol implementations.
• Embedded Memory  Approximately 6.84 Mbits of on-chip RAM for buffering, FIFOs, and embedded data storage.
• I/O and Packaging  488 user I/O pins in a 780-FBGA (29×29) package, surface-mount mounting for high-density board integration.
• Power and Temperature  Supports a core voltage range of 860 mV to 1.15 V; rated for commercial operation from 0 °C to 85 °C.
• Clocking and PLLs  Leverages Stratix III family clock resources — including multiple global and regional clocks and support for up to 12 phase-locked loops (PLLs) as described in the family documentation.
• High-speed I/O Support  Stratix III family features include support for high-speed differential I/O with SERDES and dynamic phase alignment enabling up to 1.6 Gbps signaling performance.
• Security and Reliability  Family-level options include 256-bit AES encryption for configuration bitstream protection and on-chip CRC/ECC mechanisms for configuration and memory error detection and correction.
• Compliance  RoHS compliant.

Typical Applications

• High-performance DSP and signal processing  Use the device’s abundant logic and embedded memory to implement FIR filters, FFTs, and real-time DSP pipelines.
• Prototyping and ASIC replacement  Leverage reprogrammability and large logic capacity to prototype complex SoC functions or replace custom ASICs during development.
• High-speed serial interfaces  Implement SERDES-based link layers and protocol bridging that require deterministic clocking and alignment features.
• Embedded control and data-path integration  Combine logic, memory, and clock resources to implement control planes, data buffering, and custom hardware accelerators.

Unique Advantages

• Substantial programmable logic: 80,000 logic elements support complex gateware and large custom IP integration without external logic expansion.
• Integrated on-chip memory: Approximately 6.84 Mbits of RAM reduces external memory dependency for many buffering and storage needs.
• High I/O density in compact package: 488 I/Os in a 780-FBGA (29×29) package enables dense system integration while keeping board area efficient.
• Flexible core voltage support: Core supply range from 860 mV to 1.15 V enables design trade-offs between power and performance consistent with Stratix III family practices.
• Family-level clocking and DSP resources: Access to multiple clock domains, PLLs, and high-speed SERDES capabilities simplifies implementation of timing-critical and data-centric designs.
• Security and reliability features: Family-provided AES configuration security and CRC/ECC mechanisms help protect designs and detect or correct configuration and memory errors.

Why Choose EP3SE80F780C2G?

The EP3SE80F780C2G combines a large logic element count, multi-megabit on-chip memory, and a high I/O pin count in a compact 780-FBGA package, making it well suited for demanding logic, DSP, and embedded integration tasks. Its commercial-grade rating and RoHS compliance support mainstream production deployments where Stratix III family-level clocking, security, and reliability features are required.

This device is appropriate for engineering teams developing high-capacity, reprogrammable hardware where integration density, configurable performance, and on-chip memory are key selection criteria. The Stratix III family feature set described in the device documentation complements the part’s local resources to support scalable designs and longer-term platform development.

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