EP3SE80F780C3

The EP3SE80F780C3 is a Stratix® III E Field Programmable Gate Array (FPGA) IC designed for high-density digital designs. It delivers a large logic capacity and substantial on-chip memory alongside a high I/O count, making it suitable for complex, integration-focused applications.

With support for a 0.86–1.15 V core supply, a 780-ball FCBGA package, and a commercial-grade operating range, this device targets systems requiring compact packaging, significant logic resources, and extensive I/O connectivity.

Key Features

• Core Logic Provides 80,000 logic elements to implement complex digital functions and custom processing pipelines.
• Embedded Memory Approximately 6.84 Mbits of on-chip RAM for buffering, data storage, and memory-intensive logic tasks.
• I/O Capacity 488 I/O pins to support dense external interfacing and multiple peripheral connections.
• Power and Supply Operates from a core voltage supply range of 860 mV to 1.15 V to match system power design requirements.
• Package and Mounting Surface-mount 780-ball FCBGA (780-FBGA, 29×29) package for compact board-level integration and high pin density.
• Operating Range and Grade Commercial-grade device rated for 0 °C to 85 °C ambient operation.
• Compliance RoHS compliant for conformity with standard environmental requirements.

Typical Applications

• I/O-Intensive Systems — Use the 488 I/O pins to connect multiple peripherals, sensors, or high-speed interfaces in a single compact device.
• High-Density Logic Implementations — Leverage 80,000 logic elements to consolidate complex control, signal processing, or protocol handling into one FPGA.
• On-Chip Memory Buffering — Approximately 6.84 Mbits of embedded RAM supports data buffering, packet queuing, or temporary storage for real-time processing.

Unique Advantages

• Large Logic Capacity: 80,000 logic elements enable consolidation of multi-function designs and reduce the need for external glue logic.
• Significant Embedded Memory: Approximately 6.84 Mbits of on-chip RAM lowers external memory dependency and simplifies board-level routing.
• High I/O Count: 488 I/O pins provide flexibility for extensive peripheral interfacing and parallel connectivity.
• Compact FCBGA Package: 780-ball FCBGA (29×29) offers high pin density in a surface-mount package for space-constrained applications.
• RoHS Compliant: Meets environmental compliance requirements for standard commercial deployments.
• Commercial Operating Range: Rated for 0 °C to 85 °C to suit typical commercial electronics environments.

Why Choose EP3SE80F780C3?

The EP3SE80F780C3 balances substantial logic resources, embedded memory, and a high I/O count in a compact FCBGA package, making it well-suited for designs that require integration of complex digital functions with extensive external connectivity. Its power supply and commercial operating range align with standard system designs where compactness and integration are priorities.

This FPGA is ideal for engineers and teams building high-density, I/O-rich systems that benefit from significant on-chip resources to simplify board design and reduce component count. Its RoHS compliance and well-defined electrical and thermal parameters support reliable deployment in commercial product lines.

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