EP3SE80F780C4G

The EP3SE80F780C4G is an Intel Stratix III family FPGA supplied in a 780-FBGA (29×29) surface-mount package. It delivers a balance of high logic capacity, embedded memory, and flexible I/O for high-performance logic, digital signal processing (DSP), and embedded system designs aimed at commercial-temperature applications.

With approximately 80,000 logic elements, roughly 6.84 Mbits of on-chip RAM, and 488 user I/O pins, this device targets applications that require sizable programmable logic, dedicated memory resources, and robust I/O connectivity while operating at core voltages from 860 mV to 1.15 V.

Key Features

• Core Architecture Stratix III family architecture based on a 65‑nm all‑layer copper SRAM process; supports family-level power management features such as Programmable Power Technology and selectable core voltage options.
• Logic Capacity Approximately 80,000 logic elements, enabling complex combinational and sequential logic implementations for mid-to-high density designs.
• Embedded Memory Approximately 6.84 Mbits of on-chip RAM to implement buffers, FIFOs, and memory-mapped structures within the FPGA fabric.
• DSP and Math Blocks Stratix III family devices include high-speed DSP resources and dedicated multipliers (family support for 9×9 up to 36×36 multiplier building blocks) suitable for FIR filters and multiply-accumulate routines.
• I/O and High-Speed Interfaces 488 user I/O pins in a modular bank structure; benefits from family-level support for modular I/O banks, dynamic on-chip termination, high-speed differential I/O, and SERDES with family SERDES performance characteristics.
• Clocking and PLLs Family-level support includes multiple global and regional clocks and PLL resources (Stratix III family supports up to 16 global clocks and up to 12 PLLs per device) for flexible clocking and synthesis.
• Package and Mounting 780-ball FCBGA package (29×29) with surface-mount mounting type; commercial-grade device with an operating range of 0 °C to 85 °C.
• Power and Compliance Core voltage range from 860 mV to 1.15 V and RoHS compliance for regulatory alignment in commercial assemblies.
• Security and Reliability Stratix III family features include optional 256-bit AES configuration encryption and configuration/memory integrity features such as CRC and ECC circuitry for enhanced reliability at the system level.

Typical Applications

• High‑Performance DSP Implement FIR filters, FFTs, and real‑time signal processing chains using on‑chip DSP blocks and embedded memory.
• Networking & Communications Use the device’s dense logic and high-speed I/O capability for packet processing, protocol bridging, and line-rate interface glue logic.
• Memory Interface Controllers Leverage embedded memory and I/O bank features to implement DDR/DDR2/DDR3 interface logic and buffering for external memory subsystems.
• Embedded System Prototyping Integrate custom processing, peripheral glue logic, and IP cores for system validation and prototype development within a commercial temperature envelope.

Unique Advantages

• High Logic and Memory Density: Approximately 80,000 logic elements combined with ~6.84 Mbits of embedded RAM provide room for complex logic and local data storage without excessive external components.
• Versatile I/O Connectivity: 488 user I/O pins and family-level SERDES and I/O bank features simplify interfacing to high-speed peripherals and memory devices.
• Power vs. Performance Flexibility: Core voltage range and family Programmable Power Technology enable designers to tune for lower power or higher performance as required.
• Built‑in Reliability & Security: Family support for AES encryption, CRC, and ECC improves configuration integrity and protects design IP and runtime data.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C, suitable for mainstream commercial electronic products and development platforms.
• Surface-Mount, High‑Density Package: 780-FBGA (29×29) package allows compact board integration while supporting substantial I/O and ball-count connectivity.

Why Choose EP3SE80F780C4G?

The EP3SE80F780C4G combines a substantial logic element count, multi-megabit embedded memory, and broad I/O capability in a single commercial-grade Stratix III FPGA package. It is well suited for engineers who need programmable logic for DSP, memory interfacing, and high-speed I/O in compact surface-mount form factors.

Backed by Stratix III family features—such as dedicated DSP resources, configurable clocking/PLLs, and configuration security and reliability options—this device provides a scalable platform and ecosystem support for mid-to-high complexity designs where performance, integration, and system integrity are required.

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