EP3SE80F780I3

The EP3SE80F780I3 is a Stratix III E field programmable gate array (FPGA) offering 80,000 logic elements and approximately 6.84 Mbits of embedded memory. Designed for industrial-grade deployments, it provides a large logic resource set and a high I/O count for demanding embedded and industrial applications.

This device targets systems that require dense logic integration, substantial on-chip RAM, and broad I/O connectivity while operating across an extended temperature range.

Key Features

• Core Logic 80,000 logic elements provide extensive capacity for implementing complex custom logic, state machines, and glue logic.
• Embedded Memory Approximately 6.84 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Density 488 I/O pins enable high-density external connectivity for interfaces, sensors, and peripherals.
• Power Operates from a core voltage supply range of 860 mV to 1.15 V, allowing designs to target the specified core power domain.
• Package & Mounting Supplied in a 780-FBGA (29×29) package, 780-BBGA FCBGA footprint, and intended for surface-mount assembly.
• Temperature & Grade Industrial grade device rated for an operating temperature range of −40°C to 100°C for use in extended-temperature environments.
• Standards Compliance RoHS compliant per supplier data.

Typical Applications

• Industrial Control — Use the device’s 80,000 logic elements and extended −40°C to 100°C operating range for motor control, PLC logic, and factory automation where robust, programmable logic is required.
• Communications Equipment — High I/O count and substantial embedded memory enable packet buffering, protocol handling, and interface bridging in networking and telecom fixtures.
• Test & Measurement — Implement custom signal processing, timing logic, and data capture functions using the large logic and RAM resources.

Unique Advantages

• Large Logic Capacity: 80,000 logic elements allow complex systems to be consolidated into a single device, reducing component count and board complexity.
• Significant On-Chip Memory: Approximately 6.84 Mbits of embedded RAM supports local buffering and data handling without immediate dependence on external memory.
• High I/O Count: 488 I/Os provide flexibility for dense connectivity and multiple peripheral interfaces on a single FPGA.
• Industrial Temperature Rating: −40°C to 100°C operating range enables deployment in harsh or temperature-variable environments.
• Compact BGA Package: 780-FBGA (29×29) package supports high-density PCB layouts while remaining suitable for surface-mount assembly.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious manufacturing.

Why Choose EP3SE80F780I3?

The EP3SE80F780I3 positions itself as a high-capacity, industrial-grade FPGA option for designers who need substantial logic resources, embedded memory, and a large number of I/Os in a compact BGA package. Its operating voltage range and temperature rating make it suitable for embedded and industrial applications that demand reliability across varied conditions.

This device is well suited for engineering teams consolidating multiple functions into a single programmable device, looking for scalability in logic and memory resources, and requiring RoHS compliance for production builds.

Request a quote or submit your requirements to receive pricing and availability for the EP3SE80F780I3.