EP3SE80F780I3G

The EP3SE80F780I3G is an Intel Stratix III family FPGA offering a high-performance, low-power programmable fabric for logic, DSP and embedded designs. It combines 80,000 logic elements with abundant embedded memory and a wide set of I/O resources to support compute- and data-centric applications in industrial environments.

Designed for system integration and scalability, this device targets applications that require flexible FPGA resources, high I/O density, and industrial temperature operation while providing selectable core voltage and power-optimization features described for the Stratix III family.

Key Features

• Core Capacity  Approximately 80,000 logic elements for implementing complex custom logic and control functions.
• Embedded Memory  Approximately 6.84 Mbits of on-chip RAM to support buffers, FIFOs and local data storage.
• I/O Density  488 user I/O pins to accommodate broad peripheral and bus interfacing needs.
• DSP and Processing Support  Stratix III family features include high-speed DSP blocks and support for embedded processors such as Nios II for mixed logic and embedded processing (series-level capability).
• Clocking and PLLs  Family-level support for multiple global, regional and peripheral clocks and up to 12 PLLs to enable complex clocking schemes and dynamic clock management.
• Power and Voltage  Core supply range 0.86 V to 1.15 V enabling selectable core voltage operation and power/performance trade-offs.
• Reliability and Security  Stratix III family features include configuration CRC and optional AES-based configuration security and on-chip error detection and ECC for memory blocks (series-level capabilities).
• Package and Mounting  780-ball FCBGA (780-FBGA, 29×29) surface-mount package for high-density board integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
• RoHS Compliant  Meets RoHS environmental requirements for lead-free manufacturing.

Typical Applications

• High-performance logic and DSP systems  Use the FPGA fabric and DSP capabilities for signal processing, algorithm acceleration and custom datapath implementations.
• Communications and networking equipment  High I/O density and family-level support for high-speed interfaces make the device suitable for packet processing and protocol bridging functions.
• Memory interface and buffering  On-chip memory and clocking resources support buffering, FIFO management and interfacing with external memory subsystems.
• Industrial control and automation  Industrial temperature rating and robust packaging support deployment in factory automation, motion control and equipment monitoring applications.

Unique Advantages

• Substantive logic capacity: 80,000 logic elements provide headroom for complex designs and feature integration, reducing the need for multiple devices.
• Significant embedded RAM: Approximately 6.84 Mbits of on-chip memory enables local buffering and data staging for low-latency processing.
• High I/O count: 488 user I/Os simplify connectivity to peripherals, sensors, memory and high-speed interfaces without external multiplexing.
• Industrial temperature specification: −40 °C to 100 °C operation supports deployment in harsh and variable environments.
• Flexible power profile: Core voltage range from 0.86 V to 1.15 V allows tuning for power versus performance requirements.
• Surface-mount FCBGA packaging: 780-ball 29×29 package enables compact, high-density PCB designs.

Why Choose EP3SE80F780I3G?

The EP3SE80F780I3G combines a substantial logic resource pool, multi-megabit embedded memory, and nearly 500 I/Os in a thermally rated industrial package—making it a practical choice for designs that demand on-board processing, high connectivity and reliable operation over a wide temperature range. As a member of the Stratix III family, it inherits series-level capabilities for DSP acceleration, flexible clocking and configuration security that support complex system designs.

This device is well suited to engineers and system architects building advanced industrial, communications and embedded platforms who need a scalable, programmable solution with verified family-level features and ecosystem support.

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