EP3SE80F780I3N

The EP3SE80F780I3N is a Stratix® III E Field Programmable Gate Array (FPGA) from Intel in a 780-ball FCBGA package. It delivers high logic capacity with 80,000 logic elements, approximately 6.84 Mbits of embedded memory, and 488 general-purpose I/Os for complex digital designs.

Specified for industrial-grade operation and surface-mount deployment, this device is suited to applications that require substantial on-chip logic and memory resources within a compact FCBGA footprint.

Key Features

• Core Logic 80,000 logic elements and 3,200 logic blocks provide density for large-scale combinational and sequential logic implementations.
• Embedded Memory Approximately 6.84 Mbits of on-chip RAM to support buffering, data storage, and embedded processing tasks.
• I/O Capability 488 I/O pins offering broad external connectivity for multi-channel interfaces and peripheral integration.
• Package & Mounting 780-ball BGA package (780-FBGA, 29×29) in an FCBGA footprint; surface-mount mounting type for PCB assembly.
• Power Core voltage supply range from 0.860 V to 1.15 V to match system power domains and optimize power distribution.
• Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C for demanding environmental conditions.
• Environmental Compliance RoHS compliant.

Typical Applications

• Industrial Control Systems — Industrial-grade temperature rating and abundant I/O make the device suitable for control logic, protocol bridging, and interface consolidation in factory and automation equipment.
• High-Density Logic Integration — Large logic element count and significant embedded RAM support complex state machines, data processing, and custom accelerators in embedded systems.
• Communications and Networking — High I/O count and on-chip memory capacity enable implementation of multi-channel interfaces, packet buffering, and custom protocol logic.

Unique Advantages

• High Logic Density: 80,000 logic elements provide the capacity to implement large, integrated digital functions without external logic.
• Significant On-Chip Memory: Approximately 6.84 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
• Extensive I/O Count: 488 I/Os allow flexible connectivity for multiple peripherals, sensors, or communication lanes.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in harsh environments.
• Compact FCBGA Package: 780-FBGA (29×29) balances high pin count with a compact PCB footprint for dense system designs.
• Low-Voltage Core Operation: Core supply range of 0.860 V to 1.15 V supports integration with modern power architectures.

Why Choose EP3SE80F780I3N?

The EP3SE80F780I3N combines high logic capacity, substantial embedded memory, and a large I/O complement in a compact FCBGA package, making it a practical option for designers who need to consolidate complex digital functions on a single device. Its industrial temperature rating and surface-mount package address reliability and manufacturability requirements for demanding deployments.

As a Stratix® III E device from Intel, it is targeted at projects that require scalable logic resources, significant on-chip RAM, and robust I/O capability while operating across a wide temperature range.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the EP3SE80F780I3N.