EP3SE80F780I4LG
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 132 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3200 | Number of Logic Elements/Cells | 80000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 6843392 |
Overview of EP3SE80F780I4LG – Field Programmable Gate Array (FPGA) IC
The EP3SE80F780I4LG is an Intel Stratix III family FPGA device optimized for high-performance logic, DSP and embedded applications. It integrates approximately 80,000 logic elements, rich embedded memory, and extensive I/O to support complex system designs that require programmable hardware acceleration and flexible interfacing.
Designed for industrial applications, the device combines high integration with power configurability and on-chip reliability features to address demanding communications, signal processing, and memory-interface tasks.
Key Features
- Logic Capacity — Approximately 80,000 logic elements to implement complex combinational and sequential logic designs.
- Embedded Memory — Approximately 6.84 Mbits of on-chip RAM for large buffers, FIFOs and embedded data storage.
- I/O and Interfaces — 488 user I/O pins in a modular bank structure to support a wide range of external interfaces and memory connections.
- Clocking and PLLs — Multiple global, regional and peripheral clock resources with up to 12 PLLs per device for clock synthesis and dynamic phase control (as provided by the Stratix III family).
- High-speed I/O Support — Family-level support for high-speed differential I/O with SERDES and dynamic phase alignment for up to 1.6 Gbps signaling (Stratix III family capability).
- Power and Voltage — Core supply range from 0.86 V to 1.15 V allowing selection between lower-power and higher-performance operation; surface-mount package for board-level integration.
- Security and Reliability — Family-level options for 256-bit AES configuration bitstream encryption, on-chip CRC for configuration memory error detection, and ECC for embedded memory blocks to support robust system operation.
- Package and Temperature — 780-ball FCBGA package (780-FBGA, 29×29) with operating temperature from −40 °C to 100 °C; RoHS compliant.
Typical Applications
- High-Performance DSP — Implement multi-channel FIR filters, multiply-accumulate engines and custom signal-processing pipelines using abundant logic and embedded memory.
- Network and Communications — Implement protocol bridging, packet processing and high-speed serial interfaces leveraging SERDES, clocking resources, and extensive I/O.
- Memory Interface Controllers — Build controllers and PHYs for external DDR/DDR2/DDR3 and other high-speed memories using dedicated memory interface support in the Stratix III family.
- Embedded Systems and Accelerators — Offload compute-intensive tasks from processors and implement custom accelerators or hardware-software co-processing with the device’s logic and memory resources.
Unique Advantages
- High integration in a single device: Approximately 80,000 logic elements and ~6.84 Mbits of embedded RAM reduce external components and simplify board design.
- Flexible performance vs. power trade-offs: Core voltage range (0.86–1.15 V) and family-level programmable power technologies enable tuning for lower power or higher performance.
- Robust I/O and timing resources: 488 user I/Os plus multiple clock domains and PLLs allow precise timing control and support for complex, multi-interface systems.
- Security and data integrity: Support for AES configuration encryption, CRC for configuration memory, and ECC for embedded memory blocks helps protect designs and maintain data integrity.
- Industrial temperature range: Operation from −40 °C to 100 °C suits deployments in temperature-sensitive industrial environments.
- Standards-based packaging and compliance: 780-ball FCBGA package (29×29) and RoHS compliance simplify manufacturing and regulatory alignment.
Why Choose EP3SE80F780I4LG?
The EP3SE80F780I4LG brings Stratix III family capabilities into a single, industrial-grade FPGA package suitable for designers requiring abundant logic, substantial on-chip memory and extensive I/O. Its configurable power range, clocking resources and family-level reliability and security features make it well suited for high-throughput signal processing, memory-interface controllers and network-centric applications.
This device is a strong choice for engineering teams building scalable, long-lived systems that benefit from programmable hardware acceleration, configurable power/performance trade-offs and on-chip mechanisms to protect and correct configuration and user data.
Request a quote or submit an inquiry to get pricing and availability information for EP3SE80F780I4LG and to discuss how this FPGA can fit your next design.

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