EP3SE80F780I4LG

IC FPGA 488 I/O 780FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 132 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3200Number of Logic Elements/Cells80000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits6843392

Overview of EP3SE80F780I4LG – Field Programmable Gate Array (FPGA) IC

The EP3SE80F780I4LG is an Intel Stratix III family FPGA device optimized for high-performance logic, DSP and embedded applications. It integrates approximately 80,000 logic elements, rich embedded memory, and extensive I/O to support complex system designs that require programmable hardware acceleration and flexible interfacing.

Designed for industrial applications, the device combines high integration with power configurability and on-chip reliability features to address demanding communications, signal processing, and memory-interface tasks.

Key Features

  • Logic Capacity — Approximately 80,000 logic elements to implement complex combinational and sequential logic designs.
  • Embedded Memory — Approximately 6.84 Mbits of on-chip RAM for large buffers, FIFOs and embedded data storage.
  • I/O and Interfaces — 488 user I/O pins in a modular bank structure to support a wide range of external interfaces and memory connections.
  • Clocking and PLLs — Multiple global, regional and peripheral clock resources with up to 12 PLLs per device for clock synthesis and dynamic phase control (as provided by the Stratix III family).
  • High-speed I/O Support — Family-level support for high-speed differential I/O with SERDES and dynamic phase alignment for up to 1.6 Gbps signaling (Stratix III family capability).
  • Power and Voltage — Core supply range from 0.86 V to 1.15 V allowing selection between lower-power and higher-performance operation; surface-mount package for board-level integration.
  • Security and Reliability — Family-level options for 256-bit AES configuration bitstream encryption, on-chip CRC for configuration memory error detection, and ECC for embedded memory blocks to support robust system operation.
  • Package and Temperature — 780-ball FCBGA package (780-FBGA, 29×29) with operating temperature from −40 °C to 100 °C; RoHS compliant.

Typical Applications

  • High-Performance DSP — Implement multi-channel FIR filters, multiply-accumulate engines and custom signal-processing pipelines using abundant logic and embedded memory.
  • Network and Communications — Implement protocol bridging, packet processing and high-speed serial interfaces leveraging SERDES, clocking resources, and extensive I/O.
  • Memory Interface Controllers — Build controllers and PHYs for external DDR/DDR2/DDR3 and other high-speed memories using dedicated memory interface support in the Stratix III family.
  • Embedded Systems and Accelerators — Offload compute-intensive tasks from processors and implement custom accelerators or hardware-software co-processing with the device’s logic and memory resources.

Unique Advantages

  • High integration in a single device: Approximately 80,000 logic elements and ~6.84 Mbits of embedded RAM reduce external components and simplify board design.
  • Flexible performance vs. power trade-offs: Core voltage range (0.86–1.15 V) and family-level programmable power technologies enable tuning for lower power or higher performance.
  • Robust I/O and timing resources: 488 user I/Os plus multiple clock domains and PLLs allow precise timing control and support for complex, multi-interface systems.
  • Security and data integrity: Support for AES configuration encryption, CRC for configuration memory, and ECC for embedded memory blocks helps protect designs and maintain data integrity.
  • Industrial temperature range: Operation from −40 °C to 100 °C suits deployments in temperature-sensitive industrial environments.
  • Standards-based packaging and compliance: 780-ball FCBGA package (29×29) and RoHS compliance simplify manufacturing and regulatory alignment.

Why Choose EP3SE80F780I4LG?

The EP3SE80F780I4LG brings Stratix III family capabilities into a single, industrial-grade FPGA package suitable for designers requiring abundant logic, substantial on-chip memory and extensive I/O. Its configurable power range, clocking resources and family-level reliability and security features make it well suited for high-throughput signal processing, memory-interface controllers and network-centric applications.

This device is a strong choice for engineering teams building scalable, long-lived systems that benefit from programmable hardware acceleration, configurable power/performance trade-offs and on-chip mechanisms to protect and correct configuration and user data.

Request a quote or submit an inquiry to get pricing and availability information for EP3SE80F780I4LG and to discuss how this FPGA can fit your next design.

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