EP3SL110F1152C2G

IC FPGA 744 I/O 1152FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,089 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O744Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4300Number of Logic Elements/Cells107500
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4992000

Overview of EP3SL110F1152C2G – Field Programmable Gate Array (FPGA) IC

The EP3SL110F1152C2G is an Intel Stratix III family FPGA delivering a high-density, configurable logic platform for performance-oriented digital, signal-processing and embedded designs. It combines a large logic resource pool with substantial embedded memory and flexible I/O to address applications that require complex custom logic, DSP functions, and high-pin-count system interfaces.

Designed for commercial applications, this surface-mount FCBGA device offers selectable core-voltage operation and family-level power management features to balance performance and power across varied workloads.

Key Features

  • Logic Capacity  Approximately 107,500 logic elements for implementing sizeable custom logic, control engines, and embedded state machines.
  • Embedded Memory  Approximately 4.99 Mbits of on-chip RAM to support large buffers, FIFOs and memory-intensive algorithms without external memory for many use cases.
  • High I/O Count  744 user I/Os to support wide parallel buses, multiple external peripherals and high-pin-count system interfaces.
  • Programmable Power and Core Voltage  Selectable core voltage operation (0.86 V to 1.15 V) and family Programmable Power Technology enable designers to tune power versus performance.
  • Clocking and PLL Resources  Family-level support for extensive clocking resources and multiple PLLs (as provided in the Stratix III family) for clock synthesis, skew control and timing domain management.
  • DSP and Performance-Oriented Architecture  Stratix III family DSP capabilities (dedicated multipliers and MAC functions) support compute-heavy signal processing tasks; family SERDES and phase-alignment circuitry enable high-speed serial interfaces.
  • Package and Mounting  1152-ball FBGA package (1152-FBGA, 35 × 35 mm) in an FCBGA/BBGA footprint; surface-mount for board-level integration.
  • Operating Range and Compliance  Commercial-grade operation from 0 °C to 85 °C. RoHS compliant.

Typical Applications

  • High-performance signal processing  Implement DSP pipelines, FIR filters and multiply-accumulate engines using the device's large logic and embedded memory resources.
  • Networking and communications  Support for high-speed serial interfaces and substantial I/O makes the device suitable for protocol bridging, packet processing and custom network interfaces.
  • Memory interface controllers  Large embedded memory and family-level dedicated DQS logic support complex memory buffering and controller implementations.
  • Embedded systems and custom accelerators  Use the device to offload compute-intensive tasks, implement hardware accelerators, or host custom control and data-path logic.

Unique Advantages

  • High logic density: 107,500 logic elements enable consolidation of complex functions onto a single device, reducing system BOM and board-level complexity.
  • Substantial on-chip memory: Approximately 4.99 Mbits of embedded RAM minimizes external memory dependence for many buffering and state-storage needs.
  • Flexible I/O capability: 744 user I/Os provide broad connectivity for parallel buses, peripherals and multi-channel interfaces.
  • Selectable core voltage: The 0.86 V–1.15 V supply range allows designers to prioritize lower power or higher performance per application requirements.
  • Surface-mount FCBGA packaging: 1152-ball FBGA (35 × 35 mm) simplifies placement in compact board layouts while supporting high-pin-count designs.
  • Commercial-grade reliability and compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose EP3SL110F1152C2G?

The EP3SL110F1152C2G positions itself as a high-capacity, performance-oriented FPGA suitable for designers who need extensive logic, significant embedded RAM, and broad I/O connectivity in a single commercial-grade package. Its selectable core-voltage operation and Stratix III family capabilities enable designers to balance power and performance for demanding processing and interface tasks.

This device is well suited to teams building custom compute, DSP, and high-throughput interface solutions that benefit from a mature FPGA family with documented architecture and system-level features. Its combination of logic density, memory and I/O provides a scalable foundation for mid- to high-complexity designs.

Request a quote or submit an inquiry to receive pricing and availability information for EP3SL110F1152C2G and to discuss how it fits your design requirements.

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