EP3SL110F1152C3

The EP3SL110F1152C3 is an Intel Stratix® III L field programmable gate array (FPGA) supplied in a 1152-BBGA FCBGA package. It provides 107,500 logic elements, approximately 4.992 Mbits of embedded memory, and 744 general-purpose I/O pins, delivering high integration for complex digital designs.

This device is intended for applications that require large programmable logic capacity, substantial on-chip RAM, and high I/O density within a compact surface-mount BGA footprint.

Key Features

• Core Logic  107,500 logic elements organized into 4,300 LABs, enabling sizable programmable logic for complex designs.
• Embedded Memory  Approximately 4.992 Mbits of on-chip RAM for buffering, FIFOs, and local data storage without external memory.
• I/O Density  744 general-purpose I/O pins to support wide parallel interfaces, high-pin-count peripherals, and multi-channel I/O connectivity.
• Power Supply  Operates from a core voltage range of 860 mV to 1.15 V, allowing integration into systems with defined low-voltage FPGA cores.
• Package & Mounting  1152-BBGA (FCBGA) package, supplied as 1152-FBGA (35×35), optimized for surface-mount assembly and compact board layouts.
• Temperature & Grade  Commercial grade, specified for operation from 0 °C to 85 °C.
• RoHS Compliance  Device is RoHS compliant.

Typical Applications

• High-density digital processing  Use the device's large logic element count for complex signal processing, custom datapaths, and algorithm acceleration.
• Interface aggregation and bridging  High I/O count supports combining multiple high-speed interfaces and protocol translation in a single FPGA.
• Embedded memory buffering  On-chip RAM provides local buffering and low-latency storage for streaming data or packet processing.

Unique Advantages

• High logic capacity: 107,500 logic elements provide design headroom for complex state machines, pipelines, and custom accelerators.
• Substantial on-chip RAM: Approximately 4.992 Mbits of embedded memory reduces dependence on external memory for many buffering and processing tasks.
• Extensive I/O: 744 I/O pins allow broad peripheral connectivity and parallel data paths without additional I/O expanders.
• Compact BGA package: 1152-BBGA (35×35) packaging enables dense PCB integration while supporting surface-mount assembly processes.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for standard commercial deployments.
• RoHS compliant: Conforms to RoHS requirements for environmentally conscious designs.

Why Choose EP3SL110F1152C3?

The EP3SL110F1152C3 combines a large pool of logic elements, significant on-chip RAM, and a very high I/O count in a compact FCBGA package, making it well suited to demanding digital designs that require integration of multiple functions on a single FPGA. Its commercial temperature rating and RoHS compliance make it appropriate for mainstream electronics and embedded systems.

This FPGA is a practical choice for engineering teams building systems that need scalable programmable logic resources, substantial embedded memory, and broad interface support while maintaining a compact board footprint.

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