EP3SL110F1152C4G

The EP3SL110F1152C4G is a commercial-grade Stratix III family FPGA from Intel, based on a 1.1‑V, 65‑nm all‑layer copper SRAM process. It offers a high-density, high-performance programmable logic fabric suitable for demanding logic, DSP and embedded applications.

Designed for system integration and flexible power/performance scaling, this device combines a large logic capacity, multi-megabit embedded memory, extensive I/O and advanced on-chip reliability and security features to address high-performance logic, digital signal processing and embedded system designs.

Key Features

• Logic Capacity — Approximately 107,500 logic elements to implement complex custom logic and control architectures.
• Embedded Memory — Approximately 4.99 Mbits of on-chip RAM for data buffering, FIFOs and local storage.
• I/O Density — 744 user I/O pins arranged to support wide external interfacing and modular I/O bank architectures.
• Programmable Clocking and PLLs — Up to 16 global clocks, 88 regional clocks and 116 peripheral clocks plus up to 12 PLLs for flexible clock management and synthesis.
• High‑Performance DSP — Dedicated DSP blocks supporting multipliers (9×9, 12×12, 18×18 and 36×36) and MAC/FIR implementations suitable for signal processing workloads.
• High‑Speed Serial I/O — SERDES and dynamic phase alignment circuitry supporting differential I/O with 1.6 Gbps performance for high‑speed interfaces.
• Security and Reliability — Optional 256‑bit AES volatile and non‑volatile bitstream encryption, CRC configuration memory checks and on-chip error detection/ECC for memory integrity.
• Power and Process Options — Programmable Power Technology and selectable core voltage to optimize power vs. performance; core supply range 0.86 V to 1.15 V.
• Package and Mounting — Surface-mount 1152‑FBGA (35×35) package (1152‑BBGA/FCBGA style) for compact board-level integration.
• Commercial Temperature Range — Specified for operation from 0 °C to 85 °C; RoHS compliant.

Typical Applications

• High‑Performance DSP and Signal Processing: Use dedicated DSP blocks and large logic resources to implement FIR filters, FFTs and real‑time signal chains.
• Networking and Communications: Leverage SERDES, dynamic phase alignment and high I/O counts to implement packet processing, line cards and high‑speed interfaces.
• Memory Interfaces and Controllers: Support for external DDR/DDR2/DDR3 and other memory interfaces (as provided by the Stratix III family) for high‑bandwidth buffering and memory controllers.
• Embedded Systems and Prototyping: Combine substantial on‑chip RAM, logic and clocking resources to prototype SoC functions and implement embedded control and acceleration tasks.

Unique Advantages

• High Logic and Memory Integration: Large logic element count paired with multi‑megabit embedded RAM reduces the need for external resources and simplifies system design.
• Flexible Power/Performance Tradeoffs: Selectable core voltage and Programmable Power Technology enable tuning for performance or lower power operation based on system needs.
• Built‑in Security and Reliability: AES encryption options, CRC checks and ECC support help protect configuration integrity and data stored in on‑chip memory.
• Extensive Clock and PLL Resources: Rich clocking fabric and multiple PLLs simplify multi‑domain clocking and timing-critical designs.
• Compact FBGA Package: 1152‑FBGA (35×35) surface-mount package enables high-density board layouts while delivering substantial I/O and logic.
• Commercial‑Grade Compliance: RoHS compliant and rated for 0 °C to 85 °C operation for commercial applications.

Why Choose EP3SL110F1152C4G?

The EP3SL110F1152C4G positions itself for designers who require a high‑capacity Stratix III FPGA with a balance of logic, DSP resources and embedded memory. Its selectable core voltage, extensive clocking and PLL capability, and high I/O count make it suitable for complex signal processing, networking and embedded acceleration tasks where integration and configurability matter.

Backed by Intel’s Stratix III family features—such as on‑chip security options, SERDES support and built‑in memory reliability mechanisms—this device provides a scalable platform for development and deployment of performance‑oriented FPGA designs.

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