EP3SL110F1152C4LG

The EP3SL110F1152C4LG is an Intel Stratix III family FPGA offering high logic density and flexible on-chip resources for performance-focused embedded and digital signal processing designs. Built on a 65‑nm process with selectable core voltage and programmable power optimizations, this device targets applications requiring significant logic capacity, embedded memory, and extensive I/O in a surface-mount FCBGA package.

Typical use cases include high‑performance logic, DSP acceleration, and complex system integration where a combination of logic elements, embedded RAM, programmable clocks/PLLs, and robust I/O is required.

Key Features

• Logic Capacity — 107,500 logic elements for complex digital designs and large-scale FPGA implementations.
• Embedded Memory — Approximately 4.99 Mbits of on‑chip RAM to support FIFOs, buffers, and data-path storage.
• I/O and Package — 744 user I/O pins in a surface-mount 1152-BBGA / FCBGA package (supplier package: 1152-FBGA, 35×35), enabling dense external interfacing.
• Core Voltage Range — Selectable core supply from 860 mV to 1.15 V to balance performance and power.
• Clocks and PLLs — Series-level support includes multiple global, regional, and peripheral clocks and up to 12 PLLs for flexible clocking and synchronization.
• DSP and Performance Features — Stratix III family architecture provides dedicated high-speed DSP resources and multiplier blocks suited for signal processing tasks.
• Reliability and Security — Family features include optional 256‑bit AES configuration security and built-in CRC/ECC mechanisms for configuration and memory error detection and correction.
• Temperature and Grade — Commercial grade operation from 0 °C to 85 °C; RoHS compliant.

Typical Applications

• High‑Performance DSP — Implement FIR filters, multipliers, and custom signal‑processing pipelines using the device’s dedicated DSP resources and abundant logic elements.
• Communications and Networking — Support for dense I/O and programmable clocking makes the device suitable for packet processing, protocol bridging, and high‑speed interface logic.
• Memory Interface and Controllers — Embedded RAM and modular I/O enable implementation of memory controllers, buffers, and interface logic for external memories.
• Embedded System Integration — Large logic capacity and PLL resources allow consolidation of control, interface, and processing functions into a single FPGA-based solution.

Unique Advantages

• High Logic Density: 107,500 logic elements provide headroom for complex state machines, accelerators, and multi‑function designs.
• Significant On‑Chip Memory: Approximately 4.99 Mbits of embedded RAM reduces external memory dependence for many buffering and storage needs.
• Extensive I/O in a Compact Package: 744 I/O pins in a 1152-ball FCBGA package enable high interconnect density while retaining a board‑mountable form factor.
• Power and Voltage Flexibility: Core voltage selectable between 860 mV and 1.15 V supports tradeoffs between performance and power consumption.
• Security and Reliability Features: Family-level AES key support and CRC/ECC circuitry help protect configuration data and detect/correct memory errors.
• Comprehensive Clocking: Multiple global/regional/peripheral clocks and up to 12 PLLs provide versatile timing and synchronization for complex systems.

Why Choose EP3SL110F1152C4LG?

The EP3SL110F1152C4LG combines substantial logic resources, on‑chip memory, and extensive I/O in a commercial‑grade Stratix III FPGA package, making it well suited for designers building high‑performance DSP, communications, and embedded systems. Its selectable core voltage range and family features for power management, security, and error detection provide practical tradeoffs for performance, power, and system reliability.

This device is a strong option for teams that require significant programmable logic capacity with embedded memory and robust clocking/PLL resources, and who want the ecosystem and support associated with the Stratix III family.

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