EP3SL110F1152I3N

The EP3SL110F1152I3N is a Stratix® III L Field Programmable Gate Array (FPGA) in a 1152-BBGA FCBGA package, designed for surface-mount applications. It delivers a large logic fabric, substantial embedded memory, and a high I/O count for systems that require significant integration in a compact package.

With 107,500 logic elements, approximately 4.99 Mbits of on-chip RAM and 744 general-purpose I/Os, this FPGA is suited for designs that demand dense logic resources, extensive on-chip storage, and broad external connectivity while operating across an industrial temperature range.

Key Features

• Core Logic — Provides 107,500 logic elements for implementing complex digital functions and large-scale logic integration.
• Embedded Memory — Approximately 4.99 Mbits of on-chip RAM to support buffering, queues, and memory-intensive logic without external memory dependency.
• I/O Capacity — 744 I/Os to accommodate high-pin-count interfaces and multiple peripheral connections in a single device.
• Power Supply Range — Operates from 860 mV to 1.15 V, enabling designs that require low-voltage core operation.
• Package and Mounting — 1152-BBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount FCBGA form factor for compact board layouts.
• Temperature and Grade — Industrial-grade device with an operating range of −40 °C to 100 °C for deployment in temperature-demanding environments.
• Environmental Compliance — RoHS compliant, supporting regulatory requirements for restriction of hazardous substances.

Typical Applications

• High-density I/O systems — Use the 744 I/Os to manage multiple interfaces, sensors, and peripheral connections in a single FPGA.
• Complex digital processing — Leverage 107,500 logic elements to implement custom datapaths, protocol handling, and hardware acceleration.
• Memory-intensive logic — Rely on approximately 4.99 Mbits of on-chip RAM for buffering, packet storage, and intermediate data handling without immediate external memory.
• Industrial control and automation — Industrial temperature rating and robust packaging make the device well suited for factory automation, motor control logic, and industrial communication systems.

Unique Advantages

• High logic capacity: 107,500 logic elements enable consolidation of multiple functions into one FPGA, reducing system BOM and board complexity.
• Substantial on-chip memory: Approximately 4.99 Mbits of embedded RAM supports local data storage and reduces reliance on external memory components.
• Extensive I/O count: 744 I/Os allow flexible interfacing with numerous peripherals and parallel buses without additional multiplexing hardware.
• Industrial robustness: Rated for −40 °C to 100 °C operation to meet the demands of temperature-variable industrial environments.
• Compact, board-friendly package: 1152-BBGA (35×35) FCBGA surface-mount package enables dense layouts while preserving signal routing capability.
• Regulatory readiness: RoHS compliance helps streamline environmental and regulatory requirements for product deployment.

Why Choose EP3SL110F1152I3N?

The EP3SL110F1152I3N positions itself as a high-capacity, industrial-grade FPGA for designs that require a combination of large logic resources, significant on-chip RAM, and a high number of I/Os in a compact FCBGA package. Its low-voltage core range and RoHS compliance add practical benefits for modern embedded and industrial systems.

This device is ideal for engineers and designers building complex digital systems, high-density interface controllers, and industrial automation solutions where integration, thermal range, and board-level footprint are key considerations.

Request a quote or submit a procurement inquiry to obtain pricing and availability for EP3SL110F1152I3N. Our team can help provide the information you need to move your design forward.