EP3SL110F1152I4LG

IC FPGA 744 I/O 1152FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,788 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O744Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4300Number of Logic Elements/Cells107500
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4992000

Overview of EP3SL110F1152I4LG – Field Programmable Gate Array (FPGA) IC

The EP3SL110F1152I4LG is a Stratix III family FPGA from Intel, delivered in a 1152-ball BGA package for surface-mount applications. It provides a high-density programmable fabric with extensive I/O and embedded memory, suited for high-performance logic, DSP and embedded-system designs in industrial environments.

Built on the Stratix III architecture, this device combines a large logic capacity, modular I/O and selectable core-voltage features to support complex signal-processing, networking and memory-interface applications while enabling power versus performance tradeoffs.

Key Features

  • Core Density  Approximately 107,500 logic elements for complex logic integration and large FPGA designs.
  • Embedded Memory  Approximately 4.99 Mbits of on-chip RAM to implement buffers, FIFOs and dual-port memory structures.
  • I/O Capacity  744 user I/O pins arranged to support modular bank architectures and diverse interface standards.
  • Package & Mounting  1152-BBGA / 1152-FBGA (35×35) package, surface-mount for compact board-level integration.
  • Core Voltage Range  Selectable core supply from 860 mV to 1.15 V to trade off power and performance.
  • Operating Range  Industrial operating temperature from −40°C to 100°C and RoHS-compliant construction.
  • Clocking & PLLs  Stratix III family clocking resources including multiple global and regional clocks and up to 12 PLLs for flexible clock management and synthesis.
  • High‑Performance DSP Support  Family-level DSP capabilities and dedicated multiplier blocks to accelerate multiply‑accumulate and FIR functions (as described in the Stratix III family documentation).
  • Security & Reliability  Family features include configuration-bit security options and on-chip error detection/correction circuitry for configuration and memory integrity.

Typical Applications

  • High‑Performance DSP  Signal processing systems that require large logic fabric and on-chip memory for filters, transforms and real‑time computation.
  • Networking & Communications  Protocol engines, packet processing and interface bridging using the device’s extensive I/O and clocking resources.
  • Memory Interface Controllers  Controllers and interfaces for external DDR/DDR2/DDR3 and other high-speed memories leveraging modular I/O and dedicated memory timing features.
  • Industrial Control & Automation  Embedded control systems and modular automation where industrial temperature range and surface-mount BGA packaging are required.

Unique Advantages

  • High Logic Capacity: The large logic element count enables consolidation of multiple functions onto a single device, reducing BOM complexity.
  • Significant On‑Chip Memory: Nearly 5 Mbits of embedded RAM support deep buffering and dual-port memory architectures without immediate reliance on external memory.
  • Flexible Power/Performance: Selectable core voltage (860 mV–1.15 V) allows designers to tune the device for lower power or higher performance as needed.
  • Robust I/O Count: 744 user I/Os accommodate dense peripheral connectivity and multiple interface standards on a single package.
  • Industrial Temperature Rating: Specified operation from −40°C to 100°C for reliable deployment in industrial environments.
  • Family-Level Ecosystem: Stratix III family features such as PLLs, DSP blocks and security/error-detection support provide architectural building blocks for complex system designs.

Why Choose EP3SL110F1152I4LG?

The EP3SL110F1152I4LG positions itself as a high-density, industrial-grade Stratix III FPGA option for engineers needing a balance of logic capacity, embedded memory and extensive I/O in a compact BGA package. Its selectable core voltage and family-level power-management features enable designers to optimize for power or performance depending on system requirements.

Ideal for teams developing high-performance DSP, communication, memory-interface and industrial control systems, this device delivers the architectural building blocks and operational range required for robust, long-lived designs supported by the Stratix III device family documentation and tool ecosystem.

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