EP3SL110F1152I4LG
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 1,788 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 744 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4300 | Number of Logic Elements/Cells | 107500 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 4992000 |
Overview of EP3SL110F1152I4LG – Field Programmable Gate Array (FPGA) IC
The EP3SL110F1152I4LG is a Stratix III family FPGA from Intel, delivered in a 1152-ball BGA package for surface-mount applications. It provides a high-density programmable fabric with extensive I/O and embedded memory, suited for high-performance logic, DSP and embedded-system designs in industrial environments.
Built on the Stratix III architecture, this device combines a large logic capacity, modular I/O and selectable core-voltage features to support complex signal-processing, networking and memory-interface applications while enabling power versus performance tradeoffs.
Key Features
- Core Density Approximately 107,500 logic elements for complex logic integration and large FPGA designs.
- Embedded Memory Approximately 4.99 Mbits of on-chip RAM to implement buffers, FIFOs and dual-port memory structures.
- I/O Capacity 744 user I/O pins arranged to support modular bank architectures and diverse interface standards.
- Package & Mounting 1152-BBGA / 1152-FBGA (35×35) package, surface-mount for compact board-level integration.
- Core Voltage Range Selectable core supply from 860 mV to 1.15 V to trade off power and performance.
- Operating Range Industrial operating temperature from −40°C to 100°C and RoHS-compliant construction.
- Clocking & PLLs Stratix III family clocking resources including multiple global and regional clocks and up to 12 PLLs for flexible clock management and synthesis.
- High‑Performance DSP Support Family-level DSP capabilities and dedicated multiplier blocks to accelerate multiply‑accumulate and FIR functions (as described in the Stratix III family documentation).
- Security & Reliability Family features include configuration-bit security options and on-chip error detection/correction circuitry for configuration and memory integrity.
Typical Applications
- High‑Performance DSP Signal processing systems that require large logic fabric and on-chip memory for filters, transforms and real‑time computation.
- Networking & Communications Protocol engines, packet processing and interface bridging using the device’s extensive I/O and clocking resources.
- Memory Interface Controllers Controllers and interfaces for external DDR/DDR2/DDR3 and other high-speed memories leveraging modular I/O and dedicated memory timing features.
- Industrial Control & Automation Embedded control systems and modular automation where industrial temperature range and surface-mount BGA packaging are required.
Unique Advantages
- High Logic Capacity: The large logic element count enables consolidation of multiple functions onto a single device, reducing BOM complexity.
- Significant On‑Chip Memory: Nearly 5 Mbits of embedded RAM support deep buffering and dual-port memory architectures without immediate reliance on external memory.
- Flexible Power/Performance: Selectable core voltage (860 mV–1.15 V) allows designers to tune the device for lower power or higher performance as needed.
- Robust I/O Count: 744 user I/Os accommodate dense peripheral connectivity and multiple interface standards on a single package.
- Industrial Temperature Rating: Specified operation from −40°C to 100°C for reliable deployment in industrial environments.
- Family-Level Ecosystem: Stratix III family features such as PLLs, DSP blocks and security/error-detection support provide architectural building blocks for complex system designs.
Why Choose EP3SL110F1152I4LG?
The EP3SL110F1152I4LG positions itself as a high-density, industrial-grade Stratix III FPGA option for engineers needing a balance of logic capacity, embedded memory and extensive I/O in a compact BGA package. Its selectable core voltage and family-level power-management features enable designers to optimize for power or performance depending on system requirements.
Ideal for teams developing high-performance DSP, communication, memory-interface and industrial control systems, this device delivers the architectural building blocks and operational range required for robust, long-lived designs supported by the Stratix III device family documentation and tool ecosystem.
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