EP3SL110F1152I4LN

The EP3SL110F1152I4LN is a Stratix® III L Field Programmable Gate Array (FPGA) IC designed for industrial-grade embedded and system applications. It delivers a high logic capacity and abundant on-chip RAM in a 1152‑pin ball grid array (FBGA) package for space-efficient surface-mount implementations.

With 107,500 logic elements, approximately 4.99 Mbits of embedded memory and 744 general-purpose I/Os, this device is targeted at designs that require high-density logic integration, extensive I/O connectivity, and operation across a wide industrial temperature range.

Key Features

• Core Logic — 107,500 logic elements provide substantial programmable logic resources for complex digital designs and custom hardware acceleration.
• Embedded Memory — Approximately 4.99 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage without external memory.
• I/O Capacity — 744 I/O pins support extensive peripheral interfacing and high-pin-count system integration.
• Power Supply — Device operates from 0.860 V to 1.15 V supply range, enabling compatibility with core voltage domains within that window.
• Package & Mounting — 1152‑BBGA (FCBGA) / 1152‑FBGA (35×35) supplier package in a surface-mount form factor for compact board-level designs.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial-environment deployments.
• Environmental Compliance — RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• Industrial Automation — Implement motion control, PLC logic, and real-time control functions that benefit from the device's industrial temperature rating and high I/O count.
• High‑Density Digital Systems — Use the large pool of logic elements and on-chip RAM for complex state machines, protocol processing, and custom accelerators.
• Communication Interfaces — Leverage the extensive I/O complement to implement multi-channel interface bridging, protocol conversion, and I/O-rich communication modules.
• Prototyping and Custom Hardware — Ideal for developers needing a flexible, programmable platform with substantial logic and memory resources for proof-of-concept and product development.

Unique Advantages

• High Logic Density: 107,500 logic elements enable integration of complex digital functions into a single FPGA, reducing board-level complexity.
• Substantial On-Chip Memory: Approximately 4.99 Mbits of embedded RAM minimizes dependence on external memory for buffering and data storage.
• Extensive I/O Support: 744 I/Os provide the flexibility to connect to numerous peripherals and interfaces without additional multiplexing hardware.
• Industrial-Rated Operation: −40 °C to 100 °C operating range supports deployment in demanding environmental conditions.
• Compact Surface-Mount Package: 1152‑FBGA (35×35) package enables high-density PCB layouts while maintaining robust electrical and thermal characteristics.
• Regulatory Compliance: RoHS compliance facilitates lead-free manufacturing and assembly processes.

Why Choose EP3SL110F1152I4LN?

The EP3SL110F1152I4LN positions itself as a high-capacity, industrial-grade Stratix® III L FPGA suitable for designs that require a combination of large programmable logic resources, significant embedded memory, and an extensive I/O footprint. Its surface-mount 1152‑FBGA package and wide operating temperature range make it a practical choice for compact, rugged system designs.

Engineers and procurement teams seeking a programmable device that balances integration, thermal tolerance, and on-chip resources will find this FPGA appropriate for industrial automation, communication systems, and other I/O‑intensive or compute-heavy applications. The device’s feature set supports scalability and long-term deployment within supported Intel ecosystems.

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