EP3SL110F780C2N

The EP3SL110F780C2N is a Stratix® III L FPGA from Intel, designed to deliver high logic capacity and flexible I/O integration in a compact ball-grid array package. This device provides 107,500 logic elements, approximately 4.992 Mbits of embedded memory, 4,300 CLBs, and 488 user I/O, making it suitable for complex custom logic and high-density integration where board space and pin count matter.

Packaged in a 780-ball FCBGA (29×29) with surface-mount mounting, the device is specified for commercial-grade operation from 0 °C to 85 °C and supports core supply voltages from 860 mV to 1.15 V. The product is RoHS compliant.

Key Features

• Core Logic  107,500 logic elements and 4,300 configurable logic blocks (CLBs) provide large-scale programmable logic capacity for complex designs.
• On-Chip Memory  Approximately 4.992 Mbits of embedded RAM to support buffering, state machines, and local data storage without external memory.
• I/O Resources  488 user I/O pins accommodate diverse interface requirements and high pin-count connectivity.
• Power and Voltage  Core supply voltage range of 860 mV to 1.15 V enables integration into systems with low-voltage power rails.
• Package and Mounting  780-ball FCBGA (29×29) package with surface-mount mounting for high-density PCB implementations.
• Operating Range  Commercial-grade operating temperature from 0 °C to 85 °C for general-purpose electronics and embedded applications.
• Environmental Compliance  RoHS compliant to support environmentally conscious manufacturing requirements.

Unique Advantages

• High Logic Density: 107,500 logic elements enable implementation of large, complex logic functions on a single device, reducing the need for multiple FPGAs.
• Substantial On-Chip Memory: Approximately 4.992 Mbits of embedded RAM support data buffering and state storage without immediate reliance on external memory components.
• Generous I/O Count: 488 user I/O pins provide flexibility for interfacing with multiple peripherals, mezzanine cards, or high-pin-count connectors.
• Compact System-Level Integration: The 780-ball FCBGA (29×29) surface-mount package reduces board footprint while supporting high pin density for complex systems.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation, suitable for a wide range of general embedded and consumer applications.
• Regulatory Readiness: RoHS compliance aligns with standard environmental requirements for modern electronic manufacturing.

Why Choose EP3SL110F780C2N?

The EP3SL110F780C2N combines significant programmable logic capacity, ample embedded memory, and a high I/O count in a compact FCBGA package, offering a balanced solution for complex digital designs that require integration and pin density. Its commercial-grade temperature rating and RoHS compliance make it appropriate for mainstream embedded and electronic applications where large-scale programmable logic and on-chip resources are needed.

This device is well suited for design teams and OEMs seeking scalable FPGA capacity within a compact surface-mount package, enabling consolidation of logic functions and simplifying board-level integration while maintaining compliance with common environmental standards.

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