EP3SL110F780C3G

The EP3SL110F780C3G is an Intel Stratix III family FPGA offering high-density programmable logic and on-chip memory for performance-oriented logic, DSP, and embedded designs. Built on the Stratix III architecture, it targets applications that require a combination of large logic capacity, significant embedded RAM, and flexible high-speed I/O support.

Key value propositions include a large logic fabric (approximately 107,500 logic elements), substantial embedded memory (approximately 4.99 Mbits), and family-level power and I/O capabilities such as selectable core voltage and programmable power management for balancing performance and power.

Key Features

• Logic Capacity  Approximately 107,500 logic elements suitable for large FPGA designs and complex logic functions.
• Embedded Memory  Approximately 4.99 Mbits of on-chip RAM to support data buffering, FIFOs, and local memory structures.
• I/O and Package  488 user I/O pins in a 780-pin FCBGA package (780-FBGA, 29×29); surface-mount mounting for compact board implementations.
• Power and Core Voltage  Supports core voltage range from 0.86 V to 1.15 V; Stratix III family features such as Programmable Power Technology and selectable core voltage help tune performance versus power.
• DSP and Timing (Family Features)  Stratix III family includes high-speed DSP blocks, multiple clock domains and PLL resources to support signal processing and timing-critical applications.
• High‑Speed I/O and Memory Interface Support (Family Features)  Family-level support for SERDES and high-speed external memory interfaces enables integration with DDR-class memories and high-throughput links.
• Security and Reliability (Family Features)  Optional 256-bit AES configuration-bitstream encryption and configuration memory error-detection features are available within the Stratix III family.
• Operating Range and Compliance  Commercial grade operation from 0 °C to 85 °C; RoHS-compliant component.

Typical Applications

• High-Performance DSP  Implement multi-channel signal processing, filtering, and compute-intensive algorithms using the device’s large logic and embedded memory resources.
• Communications and Networking  Use the FPGA’s high-density I/O and family-level SERDES/memory-interface capabilities for packet processing, switching fabrics, and protocol bridging.
• Embedded Systems and Prototyping  Rapidly prototype system-on-chip functions or replace custom logic with a programmable solution leveraging abundant logic elements and local RAM.
• Memory Interface and Controller Logic  Implement controllers and interfaces for external DDR-class memories using the family’s dedicated memory interface support and DQS logic.

Unique Advantages

• High logic density: Approximately 107,500 logic elements enable large, complex digital designs without immediate need for multi-device partitioning.
• Substantial on-chip RAM: Approximately 4.99 Mbits of embedded memory reduces dependence on external RAM for buffering and local storage.
• Flexible power/performance trade-offs: Core voltage range (0.86 V–1.15 V) and Stratix III programmable power features allow tuning for performance or power savings.
• Robust I/O in a compact package: 488 user I/Os in a 780-FBGA (29×29) package supports dense board-level implementations while maintaining broad signal connectivity.
• Security and reliability options: Family-level AES encryption and configuration memory error detection provide options for protecting bitstreams and improving availability.
• Commercial readiness: RoHS-compliant and specified for 0 °C to 85 °C operation for mainstream commercial applications.

Why Choose EP3SL110F780C3G?

The EP3SL110F780C3G combines a high logic element count and multi-megabit embedded memory within the Stratix III family architecture, making it suitable for designers who need a programmable platform for intensive logic and memory-centric tasks. Its package and I/O density support compact, connectivity-rich board layouts while family-level features provide configurable power management and interface flexibility.

This device is well suited for engineering teams building DSP systems, communication endpoints, memory-interface controllers, or large-scale prototypes that benefit from a scalable FPGA family architecture and available security and reliability features.

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