EP3SL110F780C3N

The EP3SL110F780C3N is a Stratix® III L field programmable gate array (FPGA) offered in a 780-ball FCBGA package. It combines a high logic capacity and on-chip memory with architecture features described in the Stratix III device handbook, including TriMatrix embedded memory blocks, DSP blocks, multi-track interconnect and advanced clocking resources.

Designed for commercial-grade applications, this device targets systems that require large logic density, substantial embedded RAM and extensive I/O connectivity while operating across a standard commercial temperature range.

Key Features

• High logic capacity — 107,500 logic elements provide substantial programmable logic resources for complex digital designs.
• Embedded memory — approximately 4.992 Mbits of on-chip RAM (Total RAM Bits: 4,992,000) for buffering, FIFOs and memory-intensive logic functions.
• Extensive I/O — 488 user I/Os support broad interfacing needs; device architecture also references high-speed differential I/O capabilities and I/O bank structures.
• DSP and compute resources — architecture documentation for the Stratix III family includes dedicated DSP blocks for arithmetic and signal-processing workloads.
• Clocking and PLLs — comprehensive clock networks and PLL resources are part of the family architecture to support multi-domain timing and high-performance designs.
• Configuration and test — family-level support for standard configuration methods and IEEE 1149.1 (JTAG) boundary-scan testing is documented in the device handbook.
• Package and mounting — 780-ball BGA / FCBGA package (supplier device package: 780-FBGA, 29×29) for surface-mount assembly.
• Power and supply — core voltage supply range specified at 860 mV to 1.15 V.
• Commercial temperature and compliance — rated for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

• High-performance signal processing — leverage the device’s DSP blocks and large logic element count for implementation of filters, transforms and real-time processing pipelines.
• Memory-interfacing systems — on-chip embedded memory and family-level external memory interfaces enable buffering and controller designs that require substantial on-chip RAM.
• High-density I/O and protocol glue logic — 488 I/Os and the Stratix III I/O architecture suit designs needing many parallel interfaces or complex protocol conversions.

Unique Advantages

• Substantial programmable fabric: 107,500 logic elements provide the headroom to implement large finite-state machines, datapaths and custom accelerators without immediate need to move to a higher-tier device.
• Significant on-chip memory: approximately 4.992 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Broad I/O count: 488 user I/Os enable extensive device-level connectivity and simplify board-level routing for multi-interface systems.
• Commercial-grade readiness: rated for 0 °C to 85 °C and RoHS compliant to align with standard commercial production and environmental requirements.
• Dense BGA packaging: 780-ball FCBGA (29×29) provides high pin-count in a compact footprint suited for surface-mount PCB designs.
• Flexible power rail: core supply range of 860 mV to 1.15 V supports designs targeting the Stratix III L power architecture.

Why Choose EP3SL110F780C3N?

The EP3SL110F780C3N positions itself as a high-capacity Stratix III L FPGA option for commercial designs that demand large logic resources, notable embedded memory and extensive I/O. Its family-level architecture—documented in the Stratix III device handbook—includes memory, DSP, clocking and I/O features that align with sophisticated digital, signal-processing and interface-driven applications.

This device is suitable for teams and projects that need scalable programmable logic with on-chip memory and dense connectivity in a 780-FBGA surface-mount package, backed by documented device-handbook features and standard configuration and test capabilities.

Request a quote or submit an inquiry for pricing and availability of EP3SL110F780C3N to begin specifying this device into your next design.