EP3SL110F780C3

The EP3SL110F780C3 is a Stratix® III L Field Programmable Gate Array (FPGA) from Intel, supplied in a 780‑ball BGA FCBGA package (29×29) for surface‑mount assembly. It is a commercial‑grade FPGA designed for board‑level integration where high logic density and extensive I/O are required.

With 107,500 logic elements, approximately 4.99 Mbits of embedded memory, and 488 user I/Os, the device targets designs that need sizable on‑chip resources while operating within a commercial temperature range of 0 °C to 85 °C. The core supply voltage range is 860 mV to 1.15 V, and the device is RoHS compliant.

Key Features

• Core Logic — 107,500 logic elements to implement complex combinational and sequential logic functions on a single device.
• Embedded Memory — Approximately 4.99 Mbits of on‑chip RAM to support buffering, LUTs, and data storage without external memory in many use cases.
• High I/O Count — 488 user I/Os for broad interface support and connectivity to peripherals, sensors, and external devices.
• Power — Core voltage supply range of 860 mV to 1.15 V, enabling integration with a range of board power architectures.
• Package & Mounting — 780‑ball BGA FCBGA package (29×29) designed for surface‑mount assembly to simplify board layout and mechanical integration.
• Temperature & Grade — Commercial grade operation from 0 °C to 85 °C for general embedded and OEM applications.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High‑density logic systems — Implement large FPGA designs that require substantial logic element counts for custom processing or control logic.
• Memory‑assisted architectures — Use the device’s embedded RAM (≈4.99 Mbits) for buffering, packet handling, or on‑chip data storage.
• I/O‑intensive interfaces — Leverage 488 I/Os to connect multiple peripherals, sensors, or parallel interfaces without external multiplexing.
• Commercial embedded platforms — Suitable for OEM designs and embedded products that operate within the 0 °C to 85 °C commercial temperature range.

Unique Advantages

• Substantial logic capacity: 107,500 logic elements allow consolidation of multiple functions into a single FPGA, reducing system complexity.
• On‑chip memory resources: Approximately 4.99 Mbits of embedded RAM minimize reliance on external memory for many buffering and storage needs.
• Extensive I/O availability: 488 user I/Os provide flexibility for dense connectivity and multi‑interface designs.
• Compact BGA footprint: 780‑ball FCBGA (29×29) enables high integration on space‑constrained PCBs while supporting surface‑mount assembly.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match a wide range of commercial embedded applications.
• RoHS compliant: Meets common environmental requirements for modern electronics manufacturing.

Why Choose EP3SL110F780C3?

The EP3SL110F780C3 balances high logic capacity, significant embedded memory, and a large I/O complement in a compact 780‑ball FCBGA package, making it well suited for commercial embedded systems and board‑level designs that demand integration and flexibility. Its core voltage range and RoHS compliance support modern power and manufacturing requirements.

This FPGA is appropriate for engineering teams and OEMs building dense, I/O‑rich designs that benefit from on‑chip resources and a compact package footprint, offering a clear path to consolidate functions and reduce external component count.

Request a quote or submit a parts request to receive pricing, availability, and lead‑time information for the EP3SL110F780C3.