EP3SL110F1152I4N

The EP3SL110F1152I4N is a Stratix® III L Field Programmable Gate Array (FPGA) IC supplied in a 1152-BBGA (FCBGA) package for surface-mount assembly. It provides a substantial on-chip resource set including 107,500 logic elements, approximately 4.992 Mbits of embedded memory, and up to 744 general-purpose I/O, making it suitable for complex, high-density programmable logic implementations in industrial environments.

Key Features

• Core / Architecture Stratix® III L FPGA IC in a 1152-BBGA FCBGA package designed for programmable logic integration.
• Logic Capacity 107,500 logic elements to implement extensive combinational and sequential logic functions.
• Embedded Memory Approximately 4.992 Mbits of on-chip RAM to support buffering, FIFOs, and local storage without immediate reliance on external memory.
• I/O Density Up to 744 I/O pins to connect multiple peripherals, buses, and interfaces directly to the FPGA fabric.
• Power Core supply range of 860 mV to 1.15 V to match system power-domains and design requirements.
• Package & Mounting 1152-BBGA, FCBGA (supplier device package: 1152-FBGA, 35 × 35 mm) in a surface-mount form factor for compact PCB integration.
• Operating Temperature & Grade Industrial-grade operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Environmental Compliance RoHS compliant.

Unique Advantages

• Extensive Logic Resources: 107,500 logic elements provide headroom for complex FPGA designs and multi-function implementations.
• Significant On-Chip Memory: Approximately 4.992 Mbits of embedded RAM reduces dependence on external memory and simplifies board-level design.
• High I/O Count: 744 I/O pins enable dense connectivity options for peripherals, high-speed interfaces, and multi-domain systems.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to maintain operation across a wide range of industrial conditions.
• Compact, Surface-Mount Packaging: 1152-BBGA FCBGA (35 × 35 mm) supports high-pin-count integration in space-constrained PCBs.
• Low-Voltage Core Compatibility: 860 mV to 1.15 V supply range enables designs targeting optimized power domains.

Why Choose EP3SL110F1152I4N?

The EP3SL110F1152I4N is positioned for designs that require a high density of programmable logic, ample embedded memory, and significant I/O capability within an industrial-grade FPGA package. Its combination of 107,500 logic elements, approximately 4.992 Mbits of on-chip RAM, and 744 I/O makes it suitable for system integrators needing a compact, surface-mount FPGA with broad connectivity and temperature robustness.

Choose this part when your design prioritizes integration density, on-chip memory to minimize external components, and reliable operation across industrial temperature ranges. The packaging and electrical supply range support streamlined board-level integration and power-domain planning.

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