EP3SL110F1152I4L

The EP3SL110F1152I4L is a Stratix® III L Field Programmable Gate Array (FPGA) IC targeted at high-density, industrial-grade designs. It combines a large logic fabric, substantial on-chip memory, and a high I/O count to address complex signal processing, control, and interfacing tasks in industrial environments.

Designed for surface-mount deployment in a 1152-BBGA (1152-FBGA, 35×35) package, this device delivers a balance of integration and scalability for systems that require many I/Os and robust operating temperature performance.

Key Features

• Logic Capacity  Approximately 107,500 logic elements to implement complex custom logic, state machines, and datapaths.
• Embedded Memory  Approximately 4.99 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• High I/O Count  744 user I/O pins to support wide parallel interfaces, dense connectivity, and multi-channel designs.
• Packaging & Mounting  1152-BBGA FCBGA package (supplier package: 1152-FBGA, 35×35) optimized for surface-mount assembly and compact board layouts.
• Power Supply Range  Core supply range 860 mV to 1.15 V to match platform power-rail requirements.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in demanding environmental conditions.
• Regulatory  RoHS compliant for streamlined environmental compliance in manufacturing.

Typical Applications

• Industrial Control Systems  Implements real-time control logic, motor control interfaces, and custom protocol bridging where high logic density and industrial temperature operation are required.
• High-Density Signal Processing  Supports multi-channel DSP pipelines and data aggregation tasks using abundant logic elements and on-chip RAM.
• Network & Interface Aggregation  Provides the I/O capacity needed for multiport bridging, protocol conversion, and dense peripheral interfacing.

Unique Advantages

• High Logic Density: Approximately 107,500 logic elements enable implementation of complex customized digital functions without external ASICs.
• Substantial On-Chip Memory: Approximately 4.99 Mbits of embedded RAM reduces dependence on external memory for buffering and packet or frame storage.
• Extensive I/O Count: 744 user I/Os allow flexible routing of parallel buses, multiple high-speed interfaces, and wide peripheral connectivity.
• Industrial Qualification: Rated for −40 °C to 100 °C operation, supporting deployments in temperature-challenging industrial installations.
• Compact FCBGA Package: 1152-FBGA (35×35) form factor supports high pin density in a compact board footprint, aiding space-constrained designs.
• RoHS Compliance: Manufactured in compliance with RoHS requirements to simplify regulatory alignment for production units.

Why Choose EP3SL110F1152I4L?

The EP3SL110F1152I4L delivers a combination of high logic capacity, sizable embedded memory, and a very high I/O count in an industrial-temperature-rated FPGA package. This makes it well suited for engineers and procurement teams developing complex control, signal processing, and multi-interface systems that need robust operation across a wide temperature range.

For designs that demand integration of dense logic and connectivity while maintaining compact board area and surface-mount assembly, this FPGA provides a scalable, specification-driven platform to implement custom hardware functions and reduce external component count.

Request a quote or submit a procurement inquiry for EP3SL110F1152I4L to discuss availability, pricing, and lead times.