EP3SL110F1152I3

The EP3SL110F1152I3 is a Stratix® III L Field Programmable Gate Array (FPGA) IC by Intel, supplied in a 1152-BBGA FCBGA package. It delivers a high-density programmable fabric with 107,500 logic elements and approximately 4.992 Mbits of embedded memory for complex digital designs.

With 744 device I/O and an industrial operating range of −40°C to 100°C, this device is targeted at applications that require large logic capacity, substantial on-chip memory, and high I/O connectivity in a compact surface-mount package.

Key Features

• Logic Capacity  107,500 logic elements to implement extensive custom logic and control functions.
• Embedded Memory  Approximately 4.992 Mbits of on-chip RAM to support buffering, FIFOs, and intermediate data storage without requiring external memory for many tasks.
• I/O Density  744 device I/O pins enable dense external connectivity for sensors, peripherals, and interface routing.
• Package  1152-BBGA FCBGA package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type suitable for automated PCB assembly.
• Power Supply  Core supply range of 860 mV to 1.15 V to match target power domains and system rails.
• Operating Range & Grade  Industrial grade device rated for operation from −40°C to 100°C to support a wide range of environmental conditions.
• RoHS Compliance  RoHS-compliant construction for regulatory and manufacturing requirements.

Typical Applications

• Industrial Control Systems  Implement complex control logic and large digital I/O counts while maintaining operation across industrial temperature ranges.
• Data Acquisition and Embedded Processing  Use the device’s logic capacity and on-chip memory for real-time buffering, preprocessing, and custom data pipelines.
• High-Density I/O Platforms  Leverage 744 I/Os to aggregate and interface many sensors, actuators, or peripheral devices in a single FPGA solution.
• Custom Embedded Platforms  Deploy as the central programmable fabric in compact, surface-mount systems requiring scalable logic and memory resources.

Unique Advantages

• High logic density: 107,500 logic elements support large-scale combinational and sequential designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 4.992 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary-storage needs.
• Extensive external connectivity: 744 I/O pins enable direct interfacing to a wide range of peripherals and system signals, simplifying board-level routing.
• Industrial temperature rating: −40°C to 100°C operation suits deployments in harsh or thermally demanding environments.
• Compact FCBGA packaging: 1152-BBGA / 1152-FBGA (35×35) package provides a high pin-count footprint in a space-efficient surface-mount form factor.
• RoHS-compliant manufacturing: Helps meet environmental and production compliance requirements.

Why Choose EP3SL110F1152I3?

The EP3SL110F1152I3 combines high logic element capacity, significant on-chip RAM, and a large I/O complement in a compact 1152-BBGA FCBGA package, making it well suited for engineers designing complex embedded systems that demand integration and connectivity. Its industrial temperature rating and RoHS compliance make it appropriate for long-life deployments in challenging environments.

Offered by Intel as part of the Stratix® III L family, this device is positioned for customers who need scalable programmable logic, embedded memory, and dense I/O in a single surface-mount package to streamline board-level integration and reduce external component count.

Request a quote or submit a pricing inquiry to evaluate EP3SL110F1152I3 for your next design and to get availability and ordering information.