EP3SL110F1152C4L

The EP3SL110F1152C4L is a Stratix® III L family FPGA offered in a 1152-ball FCBGA package, delivering high logic capacity and extensive I/O for complex digital designs. With 107,500 logic elements, approximately 4.99 Mbits of embedded memory, and 744 user I/Os, this commercial-grade device targets applications that require dense logic integration, significant on-chip RAM and large I/O counts.

Key Features

• Core Capacity — 107,500 logic elements and 4,300 logic blocks provide the resources needed to implement substantial combinational and sequential logic on a single device.
• Embedded Memory — Approximately 4.99 Mbits of on-chip RAM for buffering, state storage and small data sets without external memory.
• I/O Density — 744 user I/Os to support high-channel counts, wide parallel buses or multiple peripheral interfaces.
• Power Supply — Operates from 860 mV to 1.15 V core supply, enabling designs that require this specified core-voltage range.
• Package and Mounting — Supplied in a 1152-BBGA, FCBGA package (supplier package: 1152-FBGA, 35 × 35 mm) designed for surface-mount assembly.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS compliant for lead-free manufacturing environments.

Typical Applications

• High-density digital systems — Implement complex logic functions and large state machines using the device’s extensive logic element count.
• On-chip buffering and control — Leverage approximately 4.99 Mbits of embedded RAM for temporary storage, FIFOs and control structures without immediate need for external memory.
• Multi-channel I/O interfacing — Use the 744 I/Os to consolidate multiple parallel interfaces, sensor arrays or wide data buses on a single FPGA.

Unique Advantages

• High logic integration: 107,500 logic elements allow large portions of a system’s digital design to be implemented on one device, reducing component count.
• Substantial on-chip memory: Approximately 4.99 Mbits of embedded RAM supports buffering and temporary data storage without relying solely on external memory.
• Large I/O footprint: 744 user I/Os enable direct interfacing to numerous peripherals or parallel channels, simplifying board-level routing and I/O expansion.
• Compact package: 1152-ball FCBGA (35 × 35 mm) provides a high pin-count solution in a surface-mount form factor suitable for dense PCB layouts.
• Commercial-grade operation: Rated for 0 °C to 85 °C, appropriate for standard commercial product environments.
• RoHS compliant: Supports lead-free manufacturing and regulatory requirements for many markets.

Why Choose EP3SL110F1152C4L?

The EP3SL110F1152C4L combines a high count of logic elements, substantial embedded RAM and a large number of user I/Os in a single commercial-grade FCBGA package, making it well suited for complex digital designs that require on-chip resources and wide interfacing capability. Its package and surface-mount mounting type support dense PCB implementations while RoHS compliance aligns with modern manufacturing processes.

This device is intended for designers and teams building high-density logic systems, multi-channel interfaces and applications that benefit from significant on-chip memory. The combination of logic capacity, I/O density and packaging helps simplify system partitioning and reduce external component requirements.

Request a quote or submit a procurement inquiry to check availability and pricing for EP3SL110F1152C4L.