EP3SL110F1152C3N
| Part Description |
Stratix® III L Field Programmable Gate Array (FPGA) IC 744 4992000 107500 1152-BBGA, FCBGA |
|---|---|
| Quantity | 631 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 744 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4300 | Number of Logic Elements/Cells | 107500 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4992000 |
Overview of EP3SL110F1152C3N – Stratix III L FPGA, 1152‑FBGA, 107,500 logic elements
The EP3SL110F1152C3N is a Stratix III L field programmable gate array (FPGA) in a 1152‑ball FCBGA package designed for surface‑mount applications. This device delivers a high logic count and abundant on‑chip memory alongside a large I/O complement for complex, I/O‑heavy designs.
Targeted at designs that require high logic density, significant embedded memory, and flexible I/O, the device combines core FPGA architecture features from the Stratix III family—including embedded memory and DSP capabilities—with a commercial operating range and RoHS compliance.
Key Features
- Core Logic Provides 107,500 logic elements and 4,300 logic array blocks, enabling dense implementation of complex digital logic and control functions.
- Embedded Memory Approximately 4.99 Mbits of on‑chip RAM for buffering, state storage, and memory‑intensive functions.
- I/O Capacity 744 device I/Os to support wide parallel interfaces, multiple external devices, and high I/O channel counts.
- Device Family Capabilities Stratix III family features reflected in the device include TriMatrix embedded memory blocks, DSP blocks, multiTrack interconnect, clock networks and PLLs, and high‑speed differential I/O capabilities with DPA.
- Configuration and Test Supports standard configuration mechanisms and IEEE 1149.1 (JTAG) boundary‑scan testing as documented for the Stratix III family.
- Package & Mounting 1152‑FBGA (35×35) FCBGA package, surface‑mount mounting for compact PCB implementation.
- Power and Operating Range Core supply voltage range of 0.86 V to 1.15 V and commercial operating temperature of 0 °C to 85 °C.
- Compliance RoHS compliant.
Typical Applications
- High‑Density Digital Processing Use the device’s 107,500 logic elements and DSP blocks for complex signal processing, data path implementation, and custom compute pipelines.
- Memory‑Intensive Systems Leverage approximately 4.99 Mbits of embedded memory and TriMatrix memory blocks for buffering, packet processing, and temporary storage close to logic.
- High‑I/O Interface Designs 744 I/Os accommodate wide parallel buses, multi‑lane interfaces, or numerous peripheral connections in communication and instrumentation systems.
Unique Advantages
- High Logic Density: 107,500 logic elements enable consolidation of multiple functions into a single device, reducing board count and system complexity.
- Substantial On‑Chip Memory: Approximately 4.99 Mbits of embedded RAM supports local data storage and high‑throughput buffering without external memory for many use cases.
- Extensive I/O Resources: 744 I/Os provide design flexibility for interfacing with external memories, sensors, transceivers, and other system components.
- Family‑Level Feature Set: Inclusion of TriMatrix memory blocks, DSP blocks, PLLs, and high‑speed differential I/O capability (as documented for the Stratix III family) delivers advanced architectural options for timing, processing, and interface tuning.
- Commercial‑Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant, suitable for commercial embedded and industrial control applications within that temperature range.
- Compact, Surface‑Mount Package: 1152‑FBGA (35×35) FCBGA offers a high‑pin‑count, compact footprint for space‑constrained PCB designs.
Why Choose EP3SL110F1152C3N?
The EP3SL110F1152C3N positions itself as a high‑density, feature‑rich Stratix III L FPGA suitable for designs demanding large logic capacity, significant embedded memory, and a wide I/O complement. Its device‑family architecture provides DSP resources, advanced memory blocks, clocking networks, and interface capabilities that support complex signal processing and high‑throughput systems.
This commercial‑grade, RoHS‑compliant FPGA is appropriate for engineering teams building I/O‑intensive or compute‑dense applications who need a compact FCBGA package and the flexibility of a programmable solution backed by Stratix III family documentation and device features.
Request a quote or submit an inquiry for pricing and availability of EP3SL110F1152C3N to begin integrating this Stratix III L FPGA into your next design.

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