EP3SL110F1152C3G

The EP3SL110F1152C3G is an Intel FPGA built on the Stratix III architecture, designed for high-performance logic, DSP and embedded system integration. It combines a large logic capacity with substantial on‑chip memory and flexible I/O to address data‑intensive applications in communications, networking, and advanced signal processing.

This device delivers 107,500 logic elements, approximately 4.99 Mbits of embedded memory, and 744 user I/O pins in a 1152‑FBGA (35×35) surface‑mount package, operating from 860 mV to 1.15 V with a commercial temperature rating of 0 °C to 85 °C.

Key Features

• Stratix III architecture — Built on the Stratix III device family, offering advanced configurable fabric and architecture designed for high‑performance logic and DSP workloads.
• Logic capacity — 107,500 logic elements to implement complex control, processing, and glue‑logic functions.
• Embedded memory — Approximately 4.99 Mbits of on‑chip RAM for FIFOs, buffers and local storage.
• I/O and packaging — 744 user I/O pins in a 1152‑FBGA (35×35) FCBGA package; surface‑mount design suitable for dense board implementations.
• Power and voltage — Core supply range from 860 mV to 1.15 V, enabling selectable core voltage operation consistent with Stratix III programmable power approaches.
• Clocking and PLL support — Leverages Stratix III family clocking capabilities (family supports multiple global/regional clocks and PLLs) for complex timing and synchronization requirements.
• Security and reliability (family features) — Stratix III family includes optional 256‑bit AES configuration encryption and built‑in configuration memory CRC and ECC mechanisms for enhanced design protection and reliability.
• Commercial temperature range — Rated for 0 °C to 85 °C suitable for commercial applications; RoHS compliant.

Typical Applications

• Telecommunications and Networking — Implement protocol offloads, packet processing, and interface bridging where large logic capacity and high I/O density are required.
• High‑Performance DSP — Deploy FIR filters, multiply‑accumulate engines and signal processing pipelines using the device’s logic resources and on‑chip RAM.
• Memory Interface Controllers — Support memory controller logic and buffering for external DDR/DDR2/DDR3 and SRAM interfaces using available I/O and embedded memory.
• Embedded System Integration — Integrate custom processors, accelerators and glue logic for complex embedded platforms that demand scalable logic and flexible I/O.

Unique Advantages

• Large, scalable logic resource: 107,500 logic elements enable integration of substantial functionality into a single device, reducing board complexity.
• Significant on‑chip memory: Approximately 4.99 Mbits of embedded RAM supports large FIFOs, buffers and localized data storage without external memory overhead.
• High I/O count in a compact package: 744 user I/Os in a 1152‑FBGA (35×35) package provide density for multi‑lane interfaces and rich peripheral connectivity.
• Stratix III family reliability features: Family‑level support for configuration CRC, ECC on memory blocks, and optional AES encryption enhances system availability and IP protection.
• Flexible power options: Core voltage range from 860 mV to 1.15 V allows designers to balance performance and power within the supported supply window.
• Commercial‑grade qualification: Rated 0 °C to 85 °C and RoHS compliant for commercial product deployments.

Why Choose EP3SL110F1152C3G?

The EP3SL110F1152C3G pairs substantial logic and on‑chip memory with a high‑density I/O footprint and the Stratix III family’s architectural capabilities. It is well suited to designers who require integrated DSP and control functionality, large buffering, and configurable I/O in a single, surface‑mount package for commercial applications.

This device offers a balance of performance, integration and system‑level reliability features from the Stratix III family, making it a practical choice for complex communications, signal processing and embedded platforms that benefit from a programmable hardware implementation.

Request a quote or submit an inquiry to get pricing and availability for EP3SL110F1152C3G and to discuss how this FPGA can be integrated into your next design.