EP3SL110F1152C4

The EP3SL110F1152C4 is a Stratix® III L Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1152‑BBGA FCBGA package. It provides a large logic fabric with substantial embedded memory and a high I/O count to address complex, high‑density logic and interfacing requirements.

Key hardware attributes include 107,500 logic elements, approximately 4.99 Mbits of on‑chip RAM, 744 user I/Os, and a low-voltage supply range of 0.86 V to 1.15 V, all in a surface‑mount 1152‑FBGA (35×35) package rated for commercial temperature operation (0 °C to 85 °C).

Key Features

• Core Logic 107,500 logic elements provide the primary programmable fabric for implementing complex digital functions and custom logic.
• Embedded Memory Approximately 4.99 Mbits of on‑chip RAM for buffering, lookup tables, and distributed memory requirements.
• I/O Capacity 744 user I/Os support extensive external interfacing and parallel connectivity for high‑pin‑count designs.
• Power Operates from a core voltage supply range of 860 mV to 1.15 V to match system power architectures.
• Package and Mounting Supplied in a 1152‑BBGA FCBGA package (supplier device package listed as 1152‑FBGA, 35×35) with surface‑mount mounting for board‑level assembly.
• Temperature and Grade Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Compliance RoHS compliant.

Unique Advantages

• High logic density: 107,500 logic elements enable implementation of large, complex designs without external gate arrays.
• Substantial embedded memory: Approximately 4.99 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and data‑path needs.
• Extensive I/O resource: 744 I/Os provide flexibility for multi-channel interfaces, parallel buses, and high‑pin connectivity.
• Compact surface‑mount package: 1152‑FBGA (35×35) package balances high pin count with a compact PCB footprint for dense board layouts.
• Low core voltage support: 0.86 V to 1.15 V supply range allows integration into low‑voltage power domains.
• Commercial temperature rating: Rated for 0 °C to 85 °C suitable for standard commercial applications.

Why Choose EP3SL110F1152C4?

The EP3SL110F1152C4 combines a large logic fabric, substantial embedded memory, and a very high I/O count in a compact 1152‑FBGA surface‑mount package, making it appropriate for complex FPGA designs that require dense logic and extensive external interfacing within commercial temperature ranges. Its voltage range and package format support integration into modern low‑voltage system architectures while keeping board area optimized.

This device is suited to customers and designs that need high resource counts—logic elements, on‑chip RAM, and I/Os—delivered in a commercial‑grade, RoHS‑compliant FPGA from a recognized manufacturer.

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