EP3SL110F1152C4LN

The EP3SL110F1152C4LN is an Intel Stratix® III L field‑programmable gate array (FPGA) offered in a 1152‑BBGA (FCBGA) surface‑mount package. It provides a high logic capacity of 107,500 logic elements, approximately 4.992 Mbits of embedded memory, and up to 744 I/O pins for dense system integration.

Designed for commercial‑grade electronic designs, this device operates from a core supply range of 860 mV to 1.15 V and across an operating temperature range of 0°C to 85°C. The part is RoHS compliant and supplied in a 1152‑FBGA (35×35) package outline for board‑level mounting.

Key Features

• Core Logic Capacity — 107,500 logic elements enable implementation of complex digital logic and large combinational/sequential designs.
• Embedded Memory — Approximately 4.992 Mbits of on‑chip RAM for local buffering, state storage, and intermediate data processing.
• High I/O Count — Up to 744 I/O pins support numerous external interfaces and parallel data connections.
• Power Supply — Core voltage range of 0.86 V to 1.15 V to match system power domains and design requirements.
• Package & Mounting — 1152‑BBGA (FCBGA) package with supplier device package 1152‑FBGA (35×35), supplied for surface‑mount assembly.
• Commercial Grade & Temperature Range — Rated for commercial operation from 0°C to 85°C.
• Environmental Compliance — RoHS compliant for lead‑free manufacturing processes.

Typical Applications

• High‑density I/O systems — The 744 I/O pins support designs that require multiple parallel interfaces or extensive external connectivity.
• Complex logic implementations — With 107,500 logic elements, the device accommodates large state machines, protocol engines, and custom logic functions.
• On‑chip buffering and data staging — Approximately 4.992 Mbits of embedded memory provide local storage for data processing and pipelining needs.

Unique Advantages

• High logic density: 107,500 logic elements allow consolidation of complex functions into a single FPGA, reducing system component count.
• Substantial on‑chip memory: Approximately 4.992 Mbits of RAM supports buffering and local data operations, minimizing external memory dependencies.
• Extensive I/O capability: 744 I/O pins enable flexible interfacing with multiple peripherals, sensors, and high‑throughput buses.
• Compact FCBGA package: 1152‑BBGA / 1152‑FBGA (35×35) simplifies board layout for high‑density applications while supporting surface‑mount assembly.
• Commercial operating range: Rated 0°C to 85°C for standard commercial deployments.
• RoHS compliant: Supports lead‑free manufacturing processes and environmental compliance requirements.

Why Choose EP3SL110F1152C4LN?

The EP3SL110F1152C4LN positions itself as a high‑capacity, commercially graded FPGA for designs demanding significant logic resources, abundant I/O, and meaningful on‑chip memory. Its combination of 107,500 logic elements, roughly 4.992 Mbits of embedded RAM, and 744 I/Os in a 1152‑FBGA package makes it suitable for consolidation of complex digital functions and dense system interfaces.

Engineers and procurement teams can select this device when they need a scalable, RoHS‑compliant FPGA solution that matches commercial operating environments and modern surface‑mount assembly processes. The specified voltage and temperature ranges help ensure predictable integration into established system power and thermal envelopes.

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