EP3SL110F1152C4N

The EP3SL110F1152C4N is a Stratix® III L field programmable gate array (FPGA) supplied in a 1152-ball BGA package (1152-FBGA, 35×35). It provides a high-density programmable fabric with a large logic element count, substantial embedded memory, and a wide I/O complement for complex digital designs.

This device targets designs that require significant on-chip logic and I/O capacity while remaining within commercial temperature range and surface-mount board architectures. Key value propositions include high logic density, abundant embedded RAM, and extensive I/O, delivered in a RoHS-compliant ball-grid package.

Key Features

• Logic Capacity — 107,500 logic elements suitable for high-density digital implementation and complex custom logic functions.
• Embedded Memory — Approximately 4.99 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic blocks.
• I/O Resources — Up to 744 I/O pins to support multiple parallel interfaces and dense board-level connectivity.
• Power/Core Supply — Core voltage range from 0.86 V to 1.15 V to match system power-rail planning for the FPGA core.
• Package — 1152-BBGA (FCBGA) / supplier device package 1152-FBGA (35×35) for high-pin-count, high-density PCB integration.
• Mounting & Grade — Surface-mount device in commercial grade, operating from 0 °C to 85 °C for standard temperature environments.
• Environmental Compliance — RoHS compliant for global electronics manufacturing requirements.

Typical Applications

• High-density logic systems — Implement complex custom logic and large-scale finite-state machines using the device’s 107,500 logic elements.
• Memory-intensive designs — Leverage approximately 4.99 Mbits of embedded RAM for buffering, packet storage, and local data structures.
• I/O-rich interface boards — Utilize up to 744 I/O pins to connect multiple parallel buses, peripherals, and high-pin-count interfaces.
• Surface-mount PCB integration — 1152-FBGA package supports compact, high-density board layouts in commercial products.

Unique Advantages

• High logic density: 107,500 logic elements provide the capacity to implement large, integrated digital systems on a single device.
• Substantial on-chip memory: Approximately 4.99 Mbits of embedded RAM reduces external memory requirements and simplifies board design.
• Extensive connectivity: 744 I/O pins enable flexible partitioning of interfaces and support for complex multi-device systems.
• Compact, high-pin package: 1152-ball FBGA (35×35) offers high I/O density for space-constrained, high-performance boards.
• Commercial temperature and RoHS compliance: Clear operating range (0 °C to 85 °C) and RoHS status support standard commercial product deployments.
• Surface-mount compatibility: Designed for modern PCB assembly and automated manufacturing flows.

Why Choose EP3SL110F1152C4N?

The EP3SL110F1152C4N combines large logic capacity, generous embedded memory, and a very high I/O count in a single commercial-grade surface-mount package. It is well suited to system designs that require consolidation of complex logic, substantial on-chip buffering, and dense board-level connectivity while maintaining RoHS compliance.

For engineering teams and procurement focused on scalable, high-density FPGA implementations, this Stratix® III L device offers a clear balance of integration and board-level flexibility in a 1152-FBGA footprint and a defined commercial operating range.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for the EP3SL110F1152C4N.