EP3SL110F1152I4

The EP3SL110F1152I4 is a Stratix® III L field programmable gate array (FPGA) supplied in a 1152-ball FCBGA package. It integrates a high logic density and substantial on-chip memory with a large number of I/O, targeting industrial-class designs that require configurable digital logic in a compact surface-mount package.

Architected for applications that need large-scale programmable logic, this device combines 107,500 logic elements, approximately 4.992 Mbits of embedded memory, and 744 I/O pins, while operating across an industrial temperature range and a core voltage window of 860 mV to 1.15 V.

Key Features

• Core Logic 107,500 logic elements provide high-density programmable logic resources for complex digital functions.
• Embedded Memory Approximately 4.992 Mbits of on-chip RAM supports data buffering, state machines, and local storage for custom logic.
• I/O Capability 744 user I/O pins enable extensive external interfacing and multiple parallel connections to peripherals and subsystems.
• Power Operates with a core supply range from 860 mV to 1.15 V to match system power requirements and FPGA core specifications.
• Package & Mounting Available in a 1152-BBGA FCBGA package (supplier device package 1152-FBGA, 35×35), designed for surface-mount assembly.
• Temperature & Grade Industrial-grade device with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance RoHS compliant.

Typical Applications

• High-density digital systems Employ the device’s 107,500 logic elements to implement complex state machines, datapaths, and custom processing blocks.
• Memory‑intensive logic Use the approximately 4.992 Mbits of embedded RAM for buffering, lookup tables, and local data storage within custom architectures.
• I/O‑rich interfaces Leverage 744 I/O pins for designs that require many external connections, parallel buses, or multiple peripheral interfaces.
• Industrial embedded platforms Deploy in systems that require industrial-grade temperature support (−40 °C to 100 °C) and surface-mount packaging.

Unique Advantages

• High logic density: 107,500 logic elements allow consolidation of multiple functions into a single FPGA, reducing system complexity.
• On-chip memory capacity: Approximately 4.992 Mbits of embedded RAM supports data-intensive designs without relying solely on external memory.
• Extensive external connectivity: 744 I/O pins provide flexibility for complex interfacing and multi-channel designs.
• Industrial operating range: Rated from −40 °C to 100 °C to meet the thermal requirements of industrial applications.
• Compact surface-mount package: 1152-FBGA (35×35) package enables dense PCB layouts while maintaining robust electrical connections.
• Regulatory compliance: RoHS compliance supports eco-conscious manufacturing and procurement.

Why Choose EP3SL110F1152I4?

The EP3SL110F1152I4 strikes a balance between high integration and practical deployment: substantial logic resources (107,500 logic elements) and nearly 5 Mbits of embedded RAM combined with 744 I/O make it suitable for complex, I/O-heavy, industrial designs packaged in a compact 1152-ball FCBGA. Its core voltage range of 860 mV to 1.15 V and industrial temperature rating provide predictable, specification-driven behavior for long-term hardware projects.

This device is well suited for engineers and system designers looking to consolidate multiple functions into a single FPGA, reduce board-level component count, and maintain operation across a broad temperature range while meeting RoHS requirements.

Request a quote or submit an inquiry to get pricing and availability for the EP3SL110F1152I4 and to discuss how it can fit into your next design.