EP3SL110F1152I4G

The EP3SL110F1152I4G is an industrial-grade Stratix III family FPGA from Intel, implemented in a 65‑nm, 1.1‑V all-layer copper SRAM process. It delivers high logic density, substantial embedded memory, and extensive I/O capacity for high-performance logic, DSP and embedded system applications.

Designed for applications that require programmable performance with power efficiency and robust system-level features, this device targets communications, memory-interface controllers, industrial controls and other data-centric designs where integration and reliability matter.

Key Features

• Logic Capacity — 107,500 logic elements to implement complex logic and custom processing functions.
• Embedded Memory — Approximately 4.992 Mbits of on-chip RAM for buffering, FIFOs and on-chip data storage.
• I/O and Packaging — 744 user I/O pins in a 1152-FBGA (35×35) surface-mount package (1152-BBGA, FCBGA supplier package).
• Power and Core Voltage — Operates from a core voltage range of 860 mV to 1.15 V; Stratix III family includes selectable core voltage capability for power/performance tradeoffs.
• Temperature & Grade — Industrial grade operation with an operating temperature range of −40 °C to 100 °C and RoHS compliance.
• High‑Performance Family Capabilities — As a Stratix III device, the family provides modular I/O banks, high‑speed differential I/O with SERDES and dynamic phase alignment, dedicated DSP blocks and selectable core voltage to balance performance and power.
• System Reliability & Security (Family Features) — Stratix III family features include configuration memory CRC/ECC support and optional 256‑bit AES encryption for configuration bitstream security.

Typical Applications

• High‑Performance DSP — Implement signal processing pipelines and FIR filters using the family’s dedicated DSP resources and the device’s large logic capacity.
• Networking & Communications — Develop protocol engines and high‑speed interfaces leveraging Stratix III family SERDES, differential I/O support and modular I/O banks.
• Memory Interface Controllers — Build DDR/DDR2/DDR3 and other external memory controllers using the family’s dedicated memory interface support and DQS logic.
• Industrial Control & Automation — Use the industrial temperature grade, extensive I/O and programmable logic to implement motor control, sensor aggregation and deterministic control functions.

Unique Advantages

• High integration density: 107,500 logic elements enable consolidation of multiple functions into a single device, reducing BOM count and board complexity.
• Significant on‑chip memory: Approximately 4.992 Mbits of embedded RAM lowers dependence on external memory for buffering and real‑time data handling.
• Flexible I/O in a compact package: 744 user I/Os in a 1152‑FBGA (35×35) package provide a balance of interface density and compact PCB footprint.
• Industrial robustness: −40 °C to 100 °C operating range and surface‑mount packaging support deployment in industrial environments.
• Power/Performance tuning: Core supply range of 860 mV–1.15 V and Stratix III selectable core voltage capability allow designers to tune for performance or reduced power consumption.
• Family-level system features: Stratix III family support for SERDES, PLLs, CRC/ECC and AES encryption improves signal integrity, clocking flexibility and configuration security where required.

Why Choose EP3SL110F1152I4G?

The EP3SL110F1152I4G pairs a high logic element count with substantial on‑chip memory and broad I/O capability in an industrial-grade Stratix III device. Its combination of programmable performance, power flexibility and family-level system features makes it suitable for designers implementing complex DSP, networking, memory controller or industrial control solutions.

For projects that require scalable performance, configurability and robust operation across industrial temperature ranges, this device offers a compelling balance of integration and system-level capabilities supported by the Stratix III device family.

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