EP3SL110F1152C2N

The EP3SL110F1152C2N is a Stratix® III L Field Programmable Gate Array (FPGA) IC from Intel offered in a 1152‑FBGA (35 × 35) package. It delivers a high count of configurable logic resources, abundant embedded RAM, and a large I/O complement for dense, system‑level FPGA implementations. Targeted at commercial‑grade designs, it provides designers with a compact, surface‑mount FPGA option for applications requiring significant logic, memory, and I/O integration.

Key Features

• Core Logic  Provides 107,500 logic elements to implement complex digital functions and custom logic architectures.
• Embedded Memory  Approximately 4.992 Mbits of on‑chip RAM to support buffers, FIFOs, and local data storage for high‑throughput logic.
• I/O Density  Up to 744 I/O pins to support broad peripheral interfacing and multi‑channel connectivity within a single device.
• Power  Operates from a core voltage supply range of 860 mV to 1.15 V to match system power rails and design requirements.
• Package & Mounting  Available in a 1152‑FBGA surface‑mount package (35 × 35 mm) for high‑density board layouts and scalable assembly processes.
• Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance for regulatory alignment.

Typical Applications

• Data and Control Interfaces  High I/O count supports board‑level interface consolidation and multi‑channel signal routing.
• Compute and Acceleration  Large logic element count and embedded RAM enable custom datapath and accelerator implementations.
• System Integration  Compact FBGA package and surface‑mount mounting simplify integration into dense, space‑constrained designs.
• Prototyping and Custom Logic  Flexible logic resources allow rapid implementation of custom functions and proof‑of‑concept designs.

Unique Advantages

• High Logic Capacity: 107,500 logic elements allow implementation of large, complex digital designs without external logic expansion.
• Substantial On‑Chip Memory: Approximately 4.992 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O Resources: 744 I/O pins provide headroom for multi‑channel interfaces and high peripheral counts within a single device.
• Compact, Manufacturable Package: 1152‑FBGA (35 × 35) surface‑mount package supports high‑density PCB designs and standard assembly flows.
• Commercial‑Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliance for deployment in commercial products.
• Flexible Power Interface: Core voltage range of 860 mV to 1.15 V enables compatibility with modern power distributions and optimized power planning.

Why Choose EP3SL110F1152C2N?

The EP3SL110F1152C2N is positioned for designers who require a high‑capacity, high‑I/O FPGA in a compact, surface‑mount form factor. With more than 100k logic elements, nearly 5 Mbits of embedded RAM, and 744 I/Os, it supports integration of complex logic, buffering, and interfacing tasks into a single device while maintaining commercial‑grade operating limits.

This device is suited to engineering teams building dense, performance‑oriented FPGA solutions where board real estate, I/O count, and on‑chip memory are critical considerations. Its combination of resources offers long‑term design scalability and reduced system component count for many commercial applications.

Request a quote or submit a pricing inquiry to learn about availability, lead times, and volume options for the EP3SL110F1152C2N. Our team can provide a tailored quote to support your project timeline and procurement needs.