EP3SE80F780I4N

The EP3SE80F780I4N is a Stratix® III E field programmable gate array (FPGA) device designed for industrial-grade applications that require high logic density and extensive I/O. It integrates 80,000 logic elements and approximately 6.8 Mbits of embedded memory to support complex, custom digital designs.

Built for systems that demand broad connectivity and robust operating range, this device offers 488 I/O pins, a 780‑FBGA (29×29) surface-mount package, and an industrial temperature rating to support deployment in demanding environments.

Key Features

• Core Logic  80,000 logic elements provide substantial capacity for custom digital functions and large-scale logic integration.
• Embedded Memory  Approximately 6.8 Mbits of on-chip RAM available for data buffering, state storage, and memory-intensive logic.
• I/O Density  488 user I/O pins deliver broad external connectivity for interfacing with peripherals, sensors, and high-pin-count subsystems.
• Power Supply  Supports a core voltage supply range of 0.86 V to 1.15 V to match system power design requirements.
• Package & Mounting  Supplied in a 780‑FBGA (29×29) surface‑mount package (780‑BBGA, FCBGA), offering a compact, high-density footprint for PCB integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial environments requiring extended temperature capability.
• Regulatory Status  RoHS compliant for lead‑free manufacturing and regulatory alignment.

Typical Applications

• Industrial Control Systems  Use the device where industrial temperature tolerance and high logic density are needed for programmable control and custom automation functions.
• High‑Density I/O Systems  Ideal for designs that require many external interfaces, leveraging 488 I/O pins for sensor arrays, data acquisition, or multi‑channel I/O aggregation.
• Custom Digital Processing  Suited for embedded designs requiring substantial logic resources and on‑chip memory for application‑specific processing.

Unique Advantages

• High Logic Capacity: 80,000 logic elements enable consolidation of large or multiple functions into a single programmable device, reducing board-level component count.
• Significant On‑Chip Memory: Approximately 6.8 Mbits of embedded RAM supports local buffering and stateful logic without immediate dependence on external memory.
• Extensive I/O Count: 488 I/O pins provide flexibility to connect numerous peripherals and interfaces directly to the FPGA.
• Industrial Temperature Rating: −40 °C to 100 °C operating range makes the device suitable for deployment in a wide range of environmental conditions.
• Compact High‑Pin Package: The 780‑FBGA (29×29) surface-mount package offers a dense footprint for designs requiring both high logic density and minimized board area.
• RoHS Compliant: Supports lead‑free manufacturing processes and regulatory compliance for many markets.

Why Choose EP3SE80F780I4N?

The EP3SE80F780I4N positions itself as a high‑capacity, industrial‑grade FPGA for engineers needing extensive logic resources, embedded memory, and a large number of I/Os in a compact FCBGA package. Its electrical and environmental specifications make it an appropriate choice for robust embedded systems where integration and reliability are priorities.

This device is well suited to teams developing complex, custom digital systems that benefit from on-chip memory and high I/O count, offering a scalable platform for designs that require consolidation of multiple functions into a single programmable device.

Request a quote or submit a procurement inquiry to get pricing and availability for EP3SE80F780I4N.