EP3SE80F780I4L

The EP3SE80F780I4L is a Stratix® III E field programmable gate array (FPGA) in a 780-FBGA (29×29) package, offered in an industrial grade configuration. It combines a large logic capacity with substantial on-chip memory and a 488‑pin I/O count, enabling complex digital logic integration for industrial and embedded applications.

With an operating temperature range of −40 °C to 100 °C and a supply voltage window of 860 mV to 1.15 V, this device targets designs that require durable operation and dense programmable logic in a surface-mount form factor.

Key Features

• Core Logic  80,000 logic elements provide the programmable fabric for implementing complex digital functions and custom hardware accelerators.
• Embedded Memory  Approximately 6.84 Mbits of on-chip RAM supports large buffering, state storage, and memory-intensive logic functions without requiring external memory for many use cases.
• I/O Capacity  488 general-purpose I/O pins enable broad connectivity to peripherals, sensors, and external interfaces in dense system designs.
• Package and Mounting  780‑FBGA (29×29) package in a surface-mount footprint suited for compact PCB layouts where high pin count and thermal performance are required.
• Power Supply  Nominal supply range from 860 mV to 1.15 V allows integration into systems with low-voltage core domains.
• Operating Temperature  Rated for −40 °C to 100 °C operation to meet industrial temperature requirements.
• Regulatory & Assembly  RoHS‑compliant materials support lead‑free assembly processes and environmental compliance.

Typical Applications

• Industrial Control  Implement real-time logic for motor control, PLCs, and industrial automation systems using the device’s large logic capacity and industrial temperature rating.
• Embedded System Integration  Consolidate multiple functions onto a single FPGA to reduce board-level complexity and support custom interfaces with the device’s 488 I/Os.
• Test & Measurement  Use on-chip memory and extensive logic resources for data buffering, signal processing, and custom measurement algorithms.
• Communications and Networking  Implement protocol offloads and packet processing functions that benefit from dense logic and embedded RAM.

Unique Advantages

• High Logic Density: 80,000 logic elements allow integration of complex designs and reduce the need for multiple discrete components.
• Substantial On‑Chip Memory: Approximately 6.84 Mbits of embedded RAM supports larger buffers and memory‑intensive blocks without immediate reliance on external memory.
• Extensive I/O: 488 I/O pins provide flexibility to interface with a wide range of peripherals and external devices.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployment in environments with extended temperature demands.
• Compact Surface‑Mount Package: The 780‑FBGA (29×29) footprint enables high pin count integration in space‑constrained PCBs.
• RoHS Compliance: Material compliance for lead‑free assembly and environmental considerations.

Why Choose EP3SE80F780I4L?

The EP3SE80F780I4L positions itself as a high‑capacity Stratix® III E FPGA option for designers who need substantial programmable logic, significant embedded memory, and broad I/O in an industrial-grade device. Its combination of 80,000 logic elements, approximately 6.84 Mbits of on-chip RAM, and a 488‑pin I/O count supports consolidation of complex digital subsystems onto a single programmable device.

This FPGA is suited for engineers and product teams building industrial, embedded, and communications equipment that demand durable operation across a wide temperature range, compact surface-mount packaging, and flexible integration options. Its specifications support scalable designs and reduce system BOM by enabling high levels of functional integration.

Request a quote or submit a pricing inquiry to get availability and lead-time information for the EP3SE80F780I4L. Our team can provide technical and procurement assistance to help evaluate this FPGA for your design.