EP3SE80F780I4

The EP3SE80F780I4 is a Stratix® III E Field Programmable Gate Array (FPGA) IC providing a large logic capacity and significant on-chip memory for complex programmable designs. It is supplied in a 780‑ball FCBGA package intended for surface-mount assembly and industrial operation.

With 80,000 logic elements, approximately 6.84 Mbits of embedded RAM, and 488 I/O pins, this device targets applications that require high integration density and robust operating-range characteristics, including industrial temperature operation and RoHS compliance.

Key Features

• Programmable Logic Capacity — 80,000 logic elements to implement complex custom logic and high‑density functions.
• Logic Block Count — 3,200 logic blocks for structured logic partitioning and design organization.
• Embedded Memory — Approximately 6.84 Mbits of on‑chip RAM for buffering, packet storage, and data processing tasks.
• I/O Density — 488 user I/O pins to support multiple interfaces and parallel connections.
• Package and Mounting — 780‑BBGA / FCBGA package (supplier device package: 780‑FBGA, 29×29); surface mount for board‑level integration.
• Power Supply — Core voltage range of 860 mV to 1.15 V to match system power domains.
• Temperature Grade — Industrial operating range from −40°C to 100°C for deployment in demanding environments.
• Environmental Compliance — RoHS compliant for regulated manufacturing requirements.

Typical Applications

• Industrial Control — Implement machine control, motion logic, and protocol bridging where industrial temperature operation and high logic density are required.
• Communications Infrastructure — Use the device for interface aggregation, custom packet processing, and protocol conversion leveraging abundant I/O and embedded RAM.
• Data Processing and Acceleration — Deploy in applications that need on‑chip memory and extensive logic to realize custom data paths and buffering.
• Test and Measurement — Integrate into instrumentation that requires flexible FPGA logic, high I/O counts, and reliable operation across a wide temperature range.

Unique Advantages

• High programmable density: 80,000 logic elements provide the capacity to consolidate multiple functions into a single device, reducing board-level component count.
• Substantial on‑chip RAM: Approximately 6.84 Mbits of embedded memory supports buffering and local data storage to improve throughput and lower external memory requirements.
• Large I/O complement: 488 user I/Os enable flexible interfacing to peripherals, buses, and multi‑lane connections without extensive external glue logic.
• Industrial temperature rating: −40°C to 100°C operation makes the device suitable for systems exposed to wide temperature variations.
• Compact BGA packaging: 780‑ball FCBGA (29×29) supports high‑density board designs while maintaining a surface‑mount form factor.
• Regulatory readiness: RoHS compliance supports environmentally regulated manufacturing processes.

Why Choose EP3SE80F780I4?

The EP3SE80F780I4 positions itself as a high‑capacity Stratix® III E FPGA option for designs that require extensive programmable logic, substantial embedded memory, and a high I/O count in an industrial‑grade package. Its combination of 80,000 logic elements, approximately 6.84 Mbits of on‑chip RAM, and 488 I/Os supports consolidation of system functions and design scalability.

This device is suited for engineering teams building industrial controls, communications equipment, data processing modules, and measurement systems where temperature range, packaging density, and RoHS compliance are important selection criteria.

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