EP3SE80F780I4G

IC FPGA 488 I/O 780FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,005 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3200Number of Logic Elements/Cells80000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits6843392

Overview of EP3SE80F780I4G – Field Programmable Gate Array (FPGA) IC

The EP3SE80F780I4G is an Intel FPGA offered in a 780‑FBGA package and graded for industrial use. It delivers a high-capacity programmable fabric with 80,000 logic elements and approximately 6.84 Mbits of embedded memory, making it suitable for complex logic, DSP and embedded processing tasks.

Built on the Stratix III family architecture described in the provided datasheet, this device targets applications that require large logic capacity, substantial on‑chip memory, flexible I/O and industrial temperature operation, while providing power and configuration features documented for the Stratix III family.

Key Features

  • Logic Capacity  80,000 logic elements for implementing large-scale combinational and sequential logic functions.
  • Embedded Memory  Approximately 6.84 Mbits of on‑chip RAM to support buffering, FIFOs and local data storage.
  • I/O and Packaging  488 user I/Os in a 780‑FBGA (29x29) surface‑mount package to support dense board integration and flexible interfacing.
  • Industrial Temperature Range  Rated for −40 °C to 100 °C operation for deployment in industrial environments.
  • Core Supply  Supported core voltage range from 0.860 V to 1.15 V to accommodate selectable performance/power points.
  • Clocking and PLLs  Stratix III family features include up to 16 global clocks, multiple regional/peripheral clocks and up to 12 PLLs for complex clocking and clock synthesis needs.
  • DSP and Memory Architecture (Family)  Stratix III family documentation describes high‑speed DSP blocks and multi‑size TriMatrix memory blocks for efficient DSP and memory‑intensive processing.
  • Security and Reliability (Family)  Family features include optional 256‑bit AES configuration encryption, CRC for configuration memory, and ECC for on‑chip memory blocks to support higher availability designs.
  • Standards and Compliance  RoHS compliant and supplied in a surface‑mount FBGA package for modern PCB assembly processes.

Typical Applications

  • High‑performance logic and DSP  Implement large combinational logic, DSP pipelines and custom processing engines using substantial logic capacity and embedded memory.
  • Memory‑centric data processing  On‑chip TriMatrix memory and local RAM support buffering, packet handling and streaming data operations.
  • Networking and communications  Family‑level support for high‑speed serial I/O and protocol implementations suits networking interfaces and packet processing tasks.
  • Industrial control and embedded systems  Industrial temperature rating and flexible I/O make the device suitable for industrial controllers, motion control and sensor aggregation.

Unique Advantages

  • High integration density: 80,000 logic elements and extensive embedded memory reduce external component count and simplify board design.
  • Flexible I/O in a compact package: 488 user I/Os in a 780‑FBGA surface‑mount package enable high connector and interface density on space‑constrained PCBs.
  • Industrial robustness: Rated operation from −40 °C to 100 °C supports deployment in demanding industrial environments.
  • Configurable power/performance: Core voltage range (0.860–1.15 V) and Stratix III programmable power features enable tuning between power and performance tradeoffs.
  • Reliability and security features: Family‑level support for ECC, CRC and optional 256‑bit AES configuration encryption helps protect designs and improve system availability.
  • Clocking and timing flexibility: Multiple clock domains and up to 12 PLLs (family documentation) allow precise clock management for high‑performance designs.

Why Choose EP3SE80F780I4G?

The EP3SE80F780I4G combines large logic capacity, meaningful on‑chip memory and a high I/O count in a surface‑mount 780‑FBGA package, aimed at designers building complex logic, DSP and embedded systems for industrial applications. Its documented Stratix III family architecture provides power‑management and reliability features that support scalable, long‑life designs.

This device is suitable for teams that need a balance of performance, integration and environmental robustness, with the capacity to implement sizable custom logic and memory structures while maintaining industrial temperature operation and RoHS compliance.

Request a quote or submit a product inquiry to obtain pricing, lead time and availability for EP3SE80F780I4G.

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