EP3SE80F780I4LN

The EP3SE80F780I4LN is a Stratix® III E field programmable gate array (FPGA) from Intel, delivered in a 780‑BBGA (FCBGA) package. It provides a large logic resource set and significant on‑chip memory in an industrial‑grade, surface‑mount form factor.

Targeted for designs that require substantial programmable logic, embedded memory and high I/O count, this device is suitable for industrial applications that operate across a wide temperature and voltage range.

Key Features

• Logic Capacity  80,000 logic elements, providing substantial programmable logic resources for complex designs.
• Embedded Memory  Approximately 6.84 Mbits of on‑chip RAM to implement buffers, FIFOs, and local data storage.
• I/O Resources  488 general purpose I/O pins to support high‑density external interfacing and signal routing needs.
• Power  Core supply voltage range from 860 mV to 1.15 V, enabling compatibility with the specified system power budget.
• Package & Mounting  780‑BBGA (FCBGA) package, supplier device package listed as 780‑FBGA (29×29), designed for surface‑mount PCB assembly.
• Temperature Range  Industrial operating temperature from −40 °C to 100 °C for deployments in demanding environments.
• Compliance  RoHS‑compliant construction to meet environmental and manufacturing requirements.

Typical Applications

• Industrial Control  Use the device’s industrial temperature rating, large logic count and abundant I/O for control, sequencing and automation tasks.
• High‑Density I/O Systems  488 I/O pins allow integration with large sensor arrays, front‑panel interfaces, or parallel data buses.
• Embedded Processing and Prototyping  Combine 80,000 logic elements and approximately 6.84 Mbits of embedded memory to prototype and implement custom processing blocks and accelerators.
• Data Buffering and Local Storage  On‑chip RAM supports buffering and temporary data storage for streaming or packetized data paths.

Unique Advantages

• High logic density: 80,000 logic elements consolidate complex functions on a single device, reducing external component count.
• Substantial embedded memory: Approximately 6.84 Mbits of on‑chip RAM supports local buffering and state storage without external memory.
• Large I/O complement: 488 I/O pins enable direct interfacing to numerous peripherals and high‑channel‑count systems.
• Industrial temperature capability: −40 °C to 100 °C rating supports deployment in temperature‑challenging environments.
• Compact FCBGA packaging: 780‑BBGA (29×29) FCBGA package delivers high integration in a surface‑mount format for space‑constrained PCBs.
• RoHS compliant: Meets environmental compliance requirements for modern manufacturing.

Why Choose EP3SE80F780I4LN?

The EP3SE80F780I4LN combines a large logic fabric (80,000 logic elements), significant embedded memory (approximately 6.84 Mbits), and a high I/O count (488 pins) in an industrial‑rated, surface‑mount FCBGA package. These attributes make it a practical choice for designs that require on‑device resources and robust environmental tolerance.

This part is suitable for engineering teams and procurement seeking a field programmable device for industrial and high‑I/O applications where the specified logic, memory, I/O and temperature characteristics align with project requirements.

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