EP3SL110F1152C2

The EP3SL110F1152C2 is a Stratix® III L Field Programmable Gate Array (FPGA) IC in a 1152-BBGA FCBGA package designed for commercial-grade systems. It provides a high logic element count and extensive I/O in a surface-mount FBGA footprint for compact board-level integration.

Key on-chip resources include 107,500 logic elements and approximately 4.99 Mbits of embedded RAM, with 744 user I/O pins. The device operates from 860 mV to 1.15 V and supports commercial operating temperatures from 0 °C to 85 °C, and is RoHS compliant.

Key Features

• Core Logic 107,500 logic elements for implementing complex custom logic and glue functions.
• On‑Chip Memory Approximately 4.99 Mbits of embedded RAM to support data buffering, state storage, and local memory requirements.
• I/O Resources 744 user I/O pins to support extensive interfacing and parallel connectivity needs.
• Power Operates from 860 mV to 1.15 V, enabling designs that require this supply range for core operation.
• Package & Mounting 1152-FBGA (35×35) / 1152-BBGA FCBGA surface-mount package for dense, board-level integration.
• Operating Range Commercial-grade temperature range of 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Custom Digital Systems Implement complex programmable logic using 107,500 logic elements and substantial on-chip RAM to consolidate functions onto a single FPGA.
• High‑I/O Interface Control Use 744 I/O pins to manage multiple parallel and serial interfaces, peripheral bridging, and system glue logic.
• Embedded Memory‑Intensive Functions Leverage approximately 4.99 Mbits of embedded RAM for buffering, packet handling, or localized data storage.
• Compact Board Designs The 1152-FBGA (35×35) package supports dense PCB layouts where space and pin count are critical.

Unique Advantages

• High Logic Density: 107,500 logic elements enable integration of large-scale custom logic into a single device, reducing system complexity.
• Substantial Embedded RAM: Approximately 4.99 Mbits of on-chip memory supports local data handling and reduces reliance on external memory components.
• Extensive I/O Count: 744 I/O pins provide flexibility for complex interfacing and multiple peripheral connections without additional multiplexing hardware.
• Compact FBGA Footprint: The 1152-FBGA (35×35) package offers a high pin count in a compact surface-mount form factor for space-constrained designs.
• Commercial‑Grade and RoHS Compliant: Rated for 0 °C to 85 °C operation and RoHS compliant to meet standard commercial manufacturing and environmental requirements.
• Wide Core Supply Range: Core operation from 860 mV to 1.15 V allows design flexibility for power architectures within that range.

Why Choose EP3SL110F1152C2?

The EP3SL110F1152C2 is positioned for commercial systems that require a high degree of integration: large logic capacity, significant embedded RAM, and a very high I/O count in a compact FBGA package. These attributes make it suitable for designs that consolidate multiple functions onto a single FPGA to simplify board-level architecture.

Engineers and procurement teams looking for a RoHS-compliant, surface-mount FPGA with a commercial operating range and a 1152-FBGA footprint will find the EP3SL110F1152C2 delivers the combination of logic density, memory, and I/O needed for medium- to high-complexity embedded systems.

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