EP3SE80F780C4N

The EP3SE80F780C4N is a Stratix® III E Field Programmable Gate Array (FPGA) supplied in a 780-ball FCBGA package. It delivers a high logic element count and substantial embedded memory capacity, packaged for surface-mount assembly and targeted for commercial-grade applications.

With 80,000 logic elements, approximately 6.84 Mbits of on‑chip RAM and 488 I/O pins, this device supports designs that require dense logic integration, significant on-chip storage and broad I/O connectivity while operating within a commercial temperature range and a low-voltage supply window.

Key Features

• Logic Capacity — 80,000 logic elements to implement complex digital designs and large-scale logic functions.
• Embedded Memory — Approximately 6.84 Mbits of on‑chip RAM for buffering, packet storage and local data processing.
• I/O Count — 488 I/O pins to support extensive peripheral connectivity and parallel interfacing.
• Package and Mounting — 780‑ball BGA (780‑FBGA, 29×29) FCBGA package designed for surface‑mount PCB assembly.
• Power Supply Range — Core supply specified from 860 mV to 1.15 V to match platform power budgets and voltage domains.
• Commercial Temperature Range — Rated for operation from 0 °C to 85 °C for standard commercial environments.
• Regulatory Compliance — RoHS compliant to meet common environmental and manufacturing requirements.

Unique Advantages

• High logic density: 80,000 logic elements allow consolidation of complex functions into a single FPGA, reducing board-level component count.
• Substantial on-chip memory: Approximately 6.84 Mbits of embedded RAM supports buffering and local data handling without external memory.
• Extensive I/O resources: 488 I/O pins provide flexibility for connecting numerous peripherals, interfaces and high-pin-count subsystems.
• Compact, manufacturable package: 780‑ball FCBGA (29×29) in a surface‑mount form factor simplifies high-density PCB integration.
• Commercial suitability: Rated 0 °C to 85 °C and RoHS compliant for use in mainstream commercial electronics projects.

Why Choose EP3SE80F780C4N?

The EP3SE80F780C4N positions itself as a high‑capacity Stratix® III E FPGA option for commercial designs that demand significant logic resources, on‑chip memory and a large I/O complement in a compact BGA package. Its voltage and temperature specifications make it suitable for projects that require low-voltage core operation and standard commercial thermal environments.

This device is appropriate for engineering teams seeking to integrate complex digital functions while minimizing external components and conserving board space, delivering scalability and integration backed by the Stratix® III E architecture.

Request a quote or submit an inquiry to discuss availability, pricing and how the EP3SE80F780C4N can meet your design requirements.