EP3SE80F780C4L

The EP3SE80F780C4L is a Stratix® III E field programmable gate array (FPGA) IC from Intel, provided in a 780‑FBGA (29×29) surface‑mount package. It delivers a high logic capacity of 80,000 logic elements, approximately 6.84 Mbits of embedded memory, and 488 I/O pins, making it well suited for commercial‑grade programmable logic designs that require substantial on‑chip logic, memory and I/O density.

Designed for commercial temperature operation (0 °C to 85 °C) and a supply voltage range of 860 mV to 1.15 V, this device targets embedded and system integration projects where compact packaging and high integration are priorities.

Key Features

• Core Logic Provides 80,000 logic elements to implement complex digital designs and custom logic functions.
• Embedded Memory Approximately 6.84 Mbits of on‑chip RAM for buffers, FIFOs, and state storage without external memory.
• I/O Density 488 I/O pins to support multiple interfaces and parallel connections within a single device.
• Power Operating supply voltage range from 860 mV to 1.15 V to match system power-rail requirements.
• Package & Mounting 780‑FBGA (29×29) FCBGA surface‑mount package for high‑density board integration.
• Temperature Range Commercial grade operation from 0 °C to 85 °C.
• RoHS Compliance Environmental compliance indicated for lead‑free manufacturing processes.

Typical Applications

• Commercial Embedded Systems Implement custom control logic, protocol translation, and data handling using the device’s large logic capacity and embedded memory.
• High‑Density I/O Interfaces Aggregate and bridge multiple parallel and serial interfaces leveraging 488 available I/O pins.
• Prototyping and Development Use the FPGA for validating complex digital designs and system integration in commercial temperature environments.

Unique Advantages

• High Logic Capacity: 80,000 logic elements enable implementation of large, complex designs on a single FPGA.
• Substantial On‑Chip Memory: Approximately 6.84 Mbits of embedded RAM reduces dependency on external memory and simplifies board layout.
• Extensive I/O Count: 488 I/O pins support broad interfacing options and system consolidation.
• Compact, High‑Density Package: 780‑FBGA (29×29) surface‑mount package enables high integration in space‑constrained PCBs.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C to match typical commercial application environments.
• RoHS Compliant: Supports lead‑free manufacturing and environmental compliance requirements.

Why Choose EP3SE80F780C4L?

The EP3SE80F780C4L positions itself as a high‑capacity Stratix® III E FPGA option for commercial designs that require a balance of abundant logic elements, significant on‑chip memory, and high I/O capability in a compact FCBGA package. Its supply voltage range and commercial temperature rating make it suitable for a wide range of embedded and system integration projects.

Designers seeking to consolidate functions, reduce external component count, and implement complex programmable logic within a single device will find this FPGA aligned with those goals, offering a clear path to high‑density, integrated commercial products.

Request a quote or submit a pricing inquiry today to evaluate EP3SE80F780C4L for your next commercial FPGA design.