EP3SE80F780C3N

The EP3SE80F780C3N is a Stratix III E field-programmable gate array (FPGA) provided in a 780-ball FCBGA package for surface-mount applications. The device integrates approximately 80,000 logic elements and embedded memory to support complex, programmable digital logic and high-density system designs.

Built on the Stratix III device family architecture, the device includes on-chip memory, DSP resources, configurable clock networks and a rich I/O complement, making it suitable for designs that require high integration, programmable logic capacity and flexible I/O signaling within commercial-temperature environments.

Key Features

• Logic Capacity  Approximately 80,000 logic elements to implement large-scale programmable logic and custom digital functions.
• Embedded Memory  Approximately 6.84 Mbits of on-chip RAM (TriMatrix embedded memory blocks as described in the device family handbook) for buffering, FIFOs and local data storage.
• I/O Resources  488 general-purpose I/O pins supporting a range of interface topologies; device family documentation references high-speed differential I/O options and DPA support for serialized interfaces.
• DSP and Processing Blocks  Stratix III family DSP resources provide on-chip arithmetic and signal-processing capability (DSP blocks referenced in the device handbook).
• Clocking and PLLs  Dedicated clock networks and phase-locked loops (PLLs) are available for precise clock distribution and timing management across the fabric.
• Configuration and Test  Standard configuration features and IEEE 1149.1 (JTAG) boundary-scan testing are supported as described in the device documentation.
• Package and Mounting  780-ball FCBGA (780-BBGA, supplier package 780-FBGA 29×29) surface-mount package for compact board-level integration.
• Power and Temperature  Core supply range from 0.860 V to 1.15 V and an operating temperature range of 0 °C to 85 °C (commercial grade).
• RoHS Compliance  Device is RoHS compliant.

Typical Applications

• High‑speed data processing  On-chip logic, DSP resources and embedded memory support packet processing, data aggregation and real-time signal manipulation.
• Memory interface controllers  The device family documentation highlights external memory interfaces; the integrated logic and memory are suitable for implementing memory controllers and buffering subsystems.
• Custom I/O and protocol bridging  With 488 I/Os and high-speed differential I/O capability in the device family, the FPGA can be used to implement protocol conversion and multi‑lane interfaces.
• Embedded system prototypes  Large programmable fabric and on-chip resources make the device well suited for developing and validating complex embedded logic before system integration.

Unique Advantages

• Substantial logic capacity: Approximately 80,000 logic elements enable implementation of large custom digital systems without immediate need for multiple devices.
• Significant embedded memory: Approximately 6.84 Mbits of on-chip RAM reduces external memory dependence for many buffering and storage tasks.
• Extensive I/O count: 488 I/O pins allow broad external connectivity and support for multiple parallel interfaces on a single device.
• Compact BGA package: 780-ball FCBGA (29×29) offers a high pin density in a surface-mount footprint for space-constrained boards.
• Commercial-temperature rated: Specified for 0 °C to 85 °C operation, aligning with a wide range of commercial electronic applications.
• Standards-based test and configuration: JTAG boundary-scan and documented configuration mechanisms facilitate board-level test and field programming workflows.

Why Choose EP3SE80F780C3N?

The EP3SE80F780C3N positions itself as a high-capacity Stratix III E FPGA option that combines extensive programmable logic, substantial embedded memory and a large I/O complement in a compact FCBGA package. Its commercial temperature rating and RoHS compliance make it appropriate for demanding commercial electronic designs that require on-chip processing, high-speed interfaces and flexible system integration.

This device is suited to development teams and system designers who need scalable programmable resources, on-chip memory for real-time tasks, and a high pin count for complex external interfacing, all supported by the device family documentation and configuration features.

Request a quote or submit an inquiry for availability and pricing to begin integrating the EP3SE80F780C3N into your design workflow.