EP3SE80F780C3G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 180 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3200 | Number of Logic Elements/Cells | 80000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 6843392 |
Overview of EP3SE80F780C3G – Field Programmable Gate Array (FPGA) IC
The EP3SE80F780C3G is a Stratix III family FPGA from Intel, delivered in a 780-ball FCBGA surface-mount package. It combines high logic capacity, substantial embedded memory, and extensive I/O to address high-performance logic, DSP and embedded system tasks in commercial applications.
Designed for applications that require programmable logic, on-chip memory and flexible I/O, this device offers a balance of performance and power efficiency with a selectable core voltage range and commercial temperature grade.
Key Features
- Logic Capacity — 80,000 logic elements to implement complex combinational and sequential logic.
- Embedded Memory — Approximately 6.84 Mbits of on-chip RAM for buffering, FIFOs and memory-intensive functions.
- I/O and Package — 488 user I/O pins in a surface-mount 780-ball FBGA (29×29) / 780-BBGA (FCBGA) package for dense board routing and high pin-count designs.
- Core Voltage — Selectable supply range from 860 mV to 1.15 V to tune power versus performance.
- Clocking and PLLs — Family-level support for up to 16 global clocks, 88 regional clocks and 116 peripheral clocks, plus up to 12 PLLs for flexible clock management.
- High-speed Memory Interface Support — Stratix III family support for external memory interfaces including DDR, DDR2, DDR3, RLDRAM II, QDR II and QDR II+ (family feature).
- DSP and Arithmetic Blocks — Family includes high-speed DSP blocks and multipliers suitable for multiply-accumulate and FIR filter implementations (family feature).
- Security and Reliability — Family-level options include 256-bit AES configuration key support and configuration memory error detection and ECC for on-chip memories (family feature).
- Operating Range and Compliance — Commercial grade operation from 0 °C to 85 °C and RoHS compliance; surface-mount mounting type.
Typical Applications
- High-performance logic acceleration — Implement custom hardware acceleration for compute-intensive tasks using the device’s large logic resource pool and DSP capabilities.
- Digital signal processing (DSP) — Use the embedded memory and DSP blocks for FIR filters, real-time signal chains and multiply-accumulate workloads.
- High-speed communications — Leverage abundant I/O and family SERDES/PHY features to support networking and protocol bridging in telecom and data communications equipment.
- Embedded system prototyping — Combine programmable logic, on-chip memory and flexible clocking to prototype SoC functions and interconnect logic.
Unique Advantages
- High logic density: 80,000 logic elements provide headroom for complex implementations and multi-function designs.
- Significant on-chip memory: Approximately 6.84 Mbits of embedded RAM reduces external memory dependence for buffering and data-path staging.
- Extensive I/O in a compact package: 488 I/O pins in a 780-ball FBGA (29×29) surface-mount package simplifies high-pin-count routing while retaining a compact footprint.
- Power vs. performance flexibility: Selectable core voltage (860 mV–1.15 V) enables tuning for lower power or higher performance as design needs dictate.
- Clocking and integration: Rich clocking resources and multiple PLLs support complex timing domains and high-speed clock management.
- Commercial readiness and compliance: RoHS compliant and specified for 0 °C to 85 °C operation for commercial product deployments.
Why Choose EP3SE80F780C3G?
EP3SE80F780C3G is positioned for designers who need a commercially graded Stratix III FPGA with substantial logic capacity, multiple megabits of embedded RAM and broad I/O connectivity in a compact surface-mount FBGA package. Its selectable core voltage and family-level clocking, security and DSP features make it suitable for demanding logic, DSP and communications applications.
This device delivers a scalable platform for development and deployment where integration density, memory resources and flexible power/performance trade-offs are important. The combination of device resources and family-level features supports longer-term design scalability and integration into complex commercial systems.
Request a quote or submit an inquiry to receive pricing, lead-time and ordering information for EP3SE80F780C3G.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018