EP3SE80F780C3G

IC FPGA 488 I/O 780FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 180 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3200Number of Logic Elements/Cells80000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits6843392

Overview of EP3SE80F780C3G – Field Programmable Gate Array (FPGA) IC

The EP3SE80F780C3G is a Stratix III family FPGA from Intel, delivered in a 780-ball FCBGA surface-mount package. It combines high logic capacity, substantial embedded memory, and extensive I/O to address high-performance logic, DSP and embedded system tasks in commercial applications.

Designed for applications that require programmable logic, on-chip memory and flexible I/O, this device offers a balance of performance and power efficiency with a selectable core voltage range and commercial temperature grade.

Key Features

  • Logic Capacity — 80,000 logic elements to implement complex combinational and sequential logic.
  • Embedded Memory — Approximately 6.84 Mbits of on-chip RAM for buffering, FIFOs and memory-intensive functions.
  • I/O and Package — 488 user I/O pins in a surface-mount 780-ball FBGA (29×29) / 780-BBGA (FCBGA) package for dense board routing and high pin-count designs.
  • Core Voltage — Selectable supply range from 860 mV to 1.15 V to tune power versus performance.
  • Clocking and PLLs — Family-level support for up to 16 global clocks, 88 regional clocks and 116 peripheral clocks, plus up to 12 PLLs for flexible clock management.
  • High-speed Memory Interface Support — Stratix III family support for external memory interfaces including DDR, DDR2, DDR3, RLDRAM II, QDR II and QDR II+ (family feature).
  • DSP and Arithmetic Blocks — Family includes high-speed DSP blocks and multipliers suitable for multiply-accumulate and FIR filter implementations (family feature).
  • Security and Reliability — Family-level options include 256-bit AES configuration key support and configuration memory error detection and ECC for on-chip memories (family feature).
  • Operating Range and Compliance — Commercial grade operation from 0 °C to 85 °C and RoHS compliance; surface-mount mounting type.

Typical Applications

  • High-performance logic acceleration — Implement custom hardware acceleration for compute-intensive tasks using the device’s large logic resource pool and DSP capabilities.
  • Digital signal processing (DSP) — Use the embedded memory and DSP blocks for FIR filters, real-time signal chains and multiply-accumulate workloads.
  • High-speed communications — Leverage abundant I/O and family SERDES/PHY features to support networking and protocol bridging in telecom and data communications equipment.
  • Embedded system prototyping — Combine programmable logic, on-chip memory and flexible clocking to prototype SoC functions and interconnect logic.

Unique Advantages

  • High logic density: 80,000 logic elements provide headroom for complex implementations and multi-function designs.
  • Significant on-chip memory: Approximately 6.84 Mbits of embedded RAM reduces external memory dependence for buffering and data-path staging.
  • Extensive I/O in a compact package: 488 I/O pins in a 780-ball FBGA (29×29) surface-mount package simplifies high-pin-count routing while retaining a compact footprint.
  • Power vs. performance flexibility: Selectable core voltage (860 mV–1.15 V) enables tuning for lower power or higher performance as design needs dictate.
  • Clocking and integration: Rich clocking resources and multiple PLLs support complex timing domains and high-speed clock management.
  • Commercial readiness and compliance: RoHS compliant and specified for 0 °C to 85 °C operation for commercial product deployments.

Why Choose EP3SE80F780C3G?

EP3SE80F780C3G is positioned for designers who need a commercially graded Stratix III FPGA with substantial logic capacity, multiple megabits of embedded RAM and broad I/O connectivity in a compact surface-mount FBGA package. Its selectable core voltage and family-level clocking, security and DSP features make it suitable for demanding logic, DSP and communications applications.

This device delivers a scalable platform for development and deployment where integration density, memory resources and flexible power/performance trade-offs are important. The combination of device resources and family-level features supports longer-term design scalability and integration into complex commercial systems.

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