EP3SE80F780C4

The EP3SE80F780C4 is a Stratix® III E field programmable gate array (FPGA) supplied in a 780‑ball FCBGA package. It provides a high logic density with an architecture suitable for integrating complex digital functions, substantial embedded memory, and large I/O counts within a single device.

With approximately 80,000 logic elements, roughly 6.84 Mbits of on‑chip RAM, and 488 I/O pins, this commercial‑grade FPGA targets designs that require dense logic implementation, significant embedded memory, and extensive external interfacing while operating within a standard commercial temperature range.

Key Features

• Core Logic  Approximately 80,000 logic elements to implement complex custom digital logic and control functions.
• Embedded Memory  Approximately 6.84 Mbits of on‑chip RAM for buffering, lookup tables, and intermediate storage.
• I/O Capacity  488 general I/O pins to support wide parallel interfaces, bus bridging, and multi‑channel connectivity.
• Power  Operates from a core supply range of 860 mV to 1.15 V, enabling integration with systems using low‑voltage FPGA cores.
• Package  780‑BBGA (FCBGA) supplier device package (780‑FBGA, 29×29) for a compact, surface‑mount implementation.
• Temperature & Grade  Commercial grade device specified for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to support lead‑free assembly processes.

Typical Applications

• High‑density digital systems  Implement complex control logic, protocol handling, and custom datapaths using the device’s large logic capacity.
• Multi‑channel I/O aggregation  Aggregate and bridge numerous parallel and serial interfaces leveraging 488 available I/O pins.
• Embedded memory buffering  Use the on‑chip RAM for packet buffering, frame storage, or intermediate data staging within streaming applications.
• Custom accelerator blocks  Instantiate custom compute pipelines and offload specialized processing into the FPGA fabric.

Unique Advantages

• High logic density: Approximately 80,000 logic elements enable consolidation of multiple discrete components into a single FPGA, reducing board complexity.
• Substantial embedded memory: About 6.84 Mbits of on‑chip RAM supports local buffering and reduces external memory dependence.
• Extensive I/O capability: 488 I/Os provide flexibility for wide buses, parallel interfaces, and multi‑channel connectivity without extensive external glue logic.
• Compact ball‑grid package: The 780‑ball FCBGA package allows a high pin count in a compact footprint suitable for dense PCB layouts.
• Commercial temperature rating: Rated 0 °C to 85 °C to match typical commercial electronics operating environments.
• RoHS compliance: Supports lead‑free manufacturing and environmental compliance requirements.

Why Choose EP3SE80F780C4?

The EP3SE80F780C4 positions itself as a high‑density Stratix® III E FPGA that balances extensive logic resources, significant embedded memory, and large I/O capacity in a single commercial‑grade device. Its 780‑ball FCBGA package and low core voltage range support compact, low‑voltage system designs where board space and integration are key considerations.

This device is well suited for design teams needing to implement complex digital functions, multi‑interface bridging, or embedded buffering within a commercial temperature envelope. The combination of logic, memory, and I/O resources offers a scalable option for medium to large FPGA implementations.

Request a quote or submit an inquiry to discuss pricing, availability, and integration details for the EP3SE80F780C4.