EP3SE80F780C4LN

The EP3SE80F780C4LN is a Stratix® III E field programmable gate array (FPGA) from Intel designed for high-density, reconfigurable logic integration. Featuring 80,000 logic elements, approximately 6.84 Mbits of embedded RAM, and 488 I/O pins, it targets applications that require substantial logic capacity, on-chip memory, and broad I/O connectivity within a commercial temperature range.

Key Features

• Logic Capacity  80,000 logic elements and 3,200 CLBs provide significant on-chip configurable logic resources for complex digital designs.
• Embedded Memory  Approximately 6.84 Mbits of on-chip RAM supports data buffering, FIFOs, and local storage for high-throughput processing.
• I/O Density  488 I/O pins enable wide external connectivity for parallel interfaces, buses, and multiple peripheral channels.
• Power and Voltage  Core supply range from 0.860 V to 1.15 V accommodates system power architectures and core-voltage sequencing requirements.
• Package and Mounting  780-BBGA FCBGA package (supplier device package: 780-FBGA (29×29)) in a surface-mount form factor for high-density PCB integration.
• Temperature Grade  Commercial operating temperature range of 0 °C to 85 °C for standard commercial deployments.
• Regulatory  RoHS compliant.

Typical Applications

• Network and Communications Equipment  High logic capacity and extensive I/O are well suited for packet processing, protocol bridging, and interface aggregation functions.
• Data Acquisition and Signal Processing  On-chip RAM and abundant logic elements enable local buffering and real-time processing for instrumentation and measurement systems.
• Embedded Systems and Prototyping  Flexible reprogrammability combined with high I/O count supports custom peripherals, rapid prototyping, and system integration tasks.

Unique Advantages

• High integration density: 80,000 logic elements reduce external glue logic and simplify complex digital designs.
• Substantial on-chip memory: Approximately 6.84 Mbits of embedded RAM minimizes the need for external memory in many buffering and streaming designs.
• Extensive external connectivity: 488 I/Os provide the flexibility to interface multiple buses and peripherals without additional I/O expanders.
• Compact surface-mount package: 780-BBGA (780-FBGA, 29×29) enables high-density PCB layouts while maintaining robust physical integration.
• Commercial temperature support: Rated 0 °C to 85 °C for a wide range of standard commercial applications.
• RoHS compliant: Meets common environmental compliance requirements for electronic assemblies.

Why Choose EP3SE80F780C4LN?

The EP3SE80F780C4LN combines large logic capacity, significant embedded memory, and a high I/O count in a compact surface-mount FCBGA package, offering a balanced platform for complex digital systems that require on-chip resources and extensive external interfacing. Its commercial-grade operating range and RoHS compliance make it suitable for a broad set of standard embedded and communications designs.

This device is well matched to engineers and procurement teams designing scalable FPGA-based solutions—where integration density, on-chip memory, and connector-rich I/O are priorities—providing a straightforward path to reduce external components and simplify board-level design.

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