EP3SL110F780C2

The EP3SL110F780C2 is a Stratix® III L Field Programmable Gate Array (FPGA) offered in a 780-ball FCBGA package. It delivers a large logic fabric with 107,500 logic elements and approximately 4.992 Mbits of embedded memory in a surface-mount, commercial-grade device.

Designed for commercial embedded designs that require high logic density, substantial on-chip RAM and broad I/O connectivity, the device operates over a 0 °C to 85 °C range and supports core supply voltages from 860 mV to 1.15 V.

Key Features

• Logic Capacity 107,500 logic elements provide a high-density programmable fabric suitable for complex logic integration and custom hardware functions.
• Embedded Memory Approximately 4.992 Mbits of on-chip RAM to support data buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Resources 488 user I/O pins enable extensive interfacing options for multi-channel and multi-protocol designs.
• Package and Mounting 780-ball FCBGA package (29×29) in a surface-mount format for board-level integration where a compact, high-pin-count footprint is required.
• Power Core voltage support from 0.86 V to 1.15 V to match common low-voltage FPGA power rails.
• Temperature Grade Commercial operating range from 0 °C to 85 °C for standard commercial applications.
• Compliance RoHS compliant, supporting environmental and assembly process requirements.

Typical Applications

• High-density commercial systems Deploy where a large number of logic elements and on-chip RAM are needed to implement complex control, glue logic, or custom processing blocks.
• I/O-intensive designs Use the 488 I/O pins for boards that require multiple peripheral interfaces, parallel buses, or dense connector routing.
• Embedded platform integration Integrate into commercial embedded products that benefit from a surface-mount FCBGA package and extensive programmable resources.

Unique Advantages

• High logic density: 107,500 logic elements allow consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial on-chip RAM: Approximately 4.992 Mbits of embedded memory supports buffering and state storage without external memory for many use cases.
• Extensive I/O capacity: 488 I/Os provide flexibility for interfacing to sensors, peripherals and external devices without I/O multiplexing compromises.
• Compact, high-pin-count package: 780-FBGA (29×29) delivers a high number of pins in a compact footprint suitable for space-constrained PCBs.
• Commercial-grade readiness: Specified 0 °C to 85 °C operating range and RoHS compliance align the device with standard commercial product requirements.

Why Choose EP3SL110F780C2?

The EP3SL110F780C2 positions itself as a high-density, commercial-grade FPGA option for designs that demand substantial programmable logic, on-chip memory and broad I/O capability in a compact FCBGA package. Its combination of 107,500 logic elements, approximately 4.992 Mbits of embedded RAM and 488 I/Os supports consolidation of complex functions and flexible board-level interfacing.

This device is well suited to engineering teams and procurement groups building commercial embedded systems that require scalability, board space efficiency and RoHS-compliant components. Its operating voltage and temperature specifications make it compatible with typical commercial power and environmental profiles.

Request a quote or contact sales to discuss pricing, lead times and availability for the EP3SL110F780C2.