EP3SL110F780C4G

IC FPGA 488 I/O 780FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 199 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4300Number of Logic Elements/Cells107500
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4992000

Overview of EP3SL110F780C4G – Field Programmable Gate Array (FPGA) IC

The EP3SL110F780C4G is an Intel Stratix III series FPGA in a 780-ball FCBGA package designed for high-performance programmable logic and DSP-centric designs. Built on the Stratix III device family architecture, this device combines a large logic capacity with substantial embedded memory and flexible I/O to address demanding applications in communications, signal processing, and advanced embedded systems.

With selectable core voltage and Programmable Power Technology from the Stratix III family, the device is targeted at designs that require a balance of performance and power efficiency while maintaining commercial-grade operating conditions.

Key Features

  • Logic Capacity  107,500 logic elements (LEs) for implementing complex custom logic and control functions.
  • Embedded Memory  Approximately 4.99 Mbits of on-chip RAM to support FIFOs, buffers, and memory-intensive logic.
  • I/O Resources  488 user I/O pins delivered through modular I/O banks to interface with peripherals and external memory devices.
  • Package & Mounting  780-ball FCBGA package (780-FBGA, 29×29); surface-mount mounting type for reliable board-level integration.
  • Core Voltage Range  Operates with a core supply between 860 mV and 1.15 V and includes selectable core voltage capability as part of the Stratix III architecture.
  • Operating Temperature & Grade  Commercial grade device specified for 0 °C to 85 °C operation.
  • Family Architecture Features  Stratix III family technologies include Programmable Power Technology, selectable core voltage, high-speed DSP blocks (with dedicated multipliers up to 36×36 and documented multiplier performance up to 550 MHz), multiple PLLs and clock resources, AES configuration security options, and ECC/CRC support for configuration and memory integrity.
  • Standards & Compliance  RoHS compliant for materials and soldering process considerations.

Typical Applications

  • High-performance signal processing  Implement FIR filters, MAC chains, and custom DSP pipelines using the device's dedicated DSP resources and ample logic capacity.
  • Communications and networking  Support protocol processing, packet handling, and high-speed interface logic leveraging the modular I/O and clock/PLL resources of the Stratix III architecture.
  • Memory interface controllers  Build controllers and PHY adaptation layers for external SDRAM, DDR, or other high-speed memory interfaces using available I/O and embedded memory.
  • Embedded system offload  Offload compute-intensive tasks from a host CPU with custom logic implementations and on-chip memory for buffering and state storage.

Unique Advantages

  • Substantial logic density: 107,500 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board complexity.
  • Significant on-chip memory: Approximately 4.99 Mbits of embedded RAM supports large buffering and FIFO implementations without external memory for many use cases.
  • Flexible I/O and packaging: 488 I/O pins in a 780-ball FCBGA package provide the routing and signal density needed for complex system-level integration.
  • Power configurability: Selectable core voltage and Programmable Power Technology from the Stratix III family allow designers to tune performance versus power within the specified supply range (860 mV–1.15 V).
  • Reliability features: Family-level CRC and ECC support help detect and correct configuration and memory errors for improved system availability.
  • Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial applications.

Why Choose EP3SL110F780C4G?

The EP3SL110F780C4G delivers a balanced combination of large logic capacity, substantial embedded memory, and extensive I/O in a compact 780-ball FCBGA package. It leverages Stratix III family technologies—programmable power control, selectable core voltage, dedicated DSP blocks, and built-in reliability features—making it suitable for complex communications, DSP, and embedded applications that require both performance and design flexibility.

This device is appropriate for development teams and system designers seeking a commercially rated FPGA solution that scales to medium- to high-complexity designs while offering architectural features to manage power, clocking, and on-chip data integrity.

Request a quote or submit a purchase inquiry today to evaluate the EP3SL110F780C4G for your next high-performance FPGA design.

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