EP3SL110F780C4LN

IC FPGA 488 I/O 780FBGA
Part Description

Stratix® III L Field Programmable Gate Array (FPGA) IC 488 4992000 107500 780-BBGA, FCBGA

Quantity 598 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4300Number of Logic Elements/Cells107500
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4992000

Overview of EP3SL110F780C4LN – Stratix® III L Field Programmable Gate Array (FPGA)

The EP3SL110F780C4LN is a Stratix® III L field programmable gate array offering a large programmable fabric with 107,500 logic elements and approximately 4.99 Mbits of embedded memory. It is supplied in a 780-FBGA (29×29) surface-mount package and provides dense I/O for complex digital designs.

Designed for commercial-grade applications, this device supports a wide logic and I/O count within a supply range of 860 mV to 1.15 V and an operating temperature range of 0 °C to 85 °C, making it suitable for systems that require substantial on-chip resources and compact package integration.

Key Features

  • Core Logic — 107,500 logic elements to implement complex digital functions and custom architectures.
  • Embedded Memory — Approximately 4.99 Mbits of on-chip RAM to support buffering, packet processing, and custom memory structures.
  • I/O Density — 488 general-purpose I/O pins to interface with high-pin-count peripherals and multi-channel systems.
  • Package & Mounting — 780-FBGA (29×29) package in a surface-mount form factor for compact board-level integration.
  • Power — Core supply specification of 860 mV to 1.15 V to match system power budgets and regulator designs.
  • Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • Regulatory — RoHS compliant.

Unique Advantages

  • Large logic capacity: 107,500 logic elements enable substantial on-chip implementation of custom algorithms and parallel processing paths, reducing external component count.
  • Significant embedded memory: Approximately 4.99 Mbits of RAM supports packet buffering, lookup tables, and state storage without external memory.
  • High I/O availability: 488 I/O pins provide flexibility for multi-channel interfaces, sensor arrays, and dense bus connections.
  • Compact FCBGA package: 780-FBGA (29×29) offers a space-efficient solution for board designs that require high integration in a surface-mount form factor.
  • Commercial-grade robustness: Rated for 0 °C to 85 °C operation and RoHS compliance for deployment in general commercial systems.

Why Choose EP3SL110F780C4LN?

The EP3SL110F780C4LN positions itself as a high-capacity, tightly integrated FPGA option for designers requiring a large number of logic elements, substantial embedded memory, and dense I/O in a compact surface-mount package. Its supply voltage and commercial temperature rating make it suitable for a wide range of commercial electronic systems.

For hardware teams and procurement groups targeting designs that prioritize on-chip resources and board-space efficiency, this Stratix® III L device delivers scalable logic capacity and memory while maintaining compliance with RoHS requirements.

Request a quote or submit a purchase inquiry for EP3SL110F780C4LN to receive pricing, availability, and lead-time details tailored to your project requirements.

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