EP3SL110F780C4LN
| Part Description |
Stratix® III L Field Programmable Gate Array (FPGA) IC 488 4992000 107500 780-BBGA, FCBGA |
|---|---|
| Quantity | 598 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4300 | Number of Logic Elements/Cells | 107500 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4992000 |
Overview of EP3SL110F780C4LN – Stratix® III L Field Programmable Gate Array (FPGA)
The EP3SL110F780C4LN is a Stratix® III L field programmable gate array offering a large programmable fabric with 107,500 logic elements and approximately 4.99 Mbits of embedded memory. It is supplied in a 780-FBGA (29×29) surface-mount package and provides dense I/O for complex digital designs.
Designed for commercial-grade applications, this device supports a wide logic and I/O count within a supply range of 860 mV to 1.15 V and an operating temperature range of 0 °C to 85 °C, making it suitable for systems that require substantial on-chip resources and compact package integration.
Key Features
- Core Logic — 107,500 logic elements to implement complex digital functions and custom architectures.
- Embedded Memory — Approximately 4.99 Mbits of on-chip RAM to support buffering, packet processing, and custom memory structures.
- I/O Density — 488 general-purpose I/O pins to interface with high-pin-count peripherals and multi-channel systems.
- Package & Mounting — 780-FBGA (29×29) package in a surface-mount form factor for compact board-level integration.
- Power — Core supply specification of 860 mV to 1.15 V to match system power budgets and regulator designs.
- Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
- Regulatory — RoHS compliant.
Unique Advantages
- Large logic capacity: 107,500 logic elements enable substantial on-chip implementation of custom algorithms and parallel processing paths, reducing external component count.
- Significant embedded memory: Approximately 4.99 Mbits of RAM supports packet buffering, lookup tables, and state storage without external memory.
- High I/O availability: 488 I/O pins provide flexibility for multi-channel interfaces, sensor arrays, and dense bus connections.
- Compact FCBGA package: 780-FBGA (29×29) offers a space-efficient solution for board designs that require high integration in a surface-mount form factor.
- Commercial-grade robustness: Rated for 0 °C to 85 °C operation and RoHS compliance for deployment in general commercial systems.
Why Choose EP3SL110F780C4LN?
The EP3SL110F780C4LN positions itself as a high-capacity, tightly integrated FPGA option for designers requiring a large number of logic elements, substantial embedded memory, and dense I/O in a compact surface-mount package. Its supply voltage and commercial temperature rating make it suitable for a wide range of commercial electronic systems.
For hardware teams and procurement groups targeting designs that prioritize on-chip resources and board-space efficiency, this Stratix® III L device delivers scalable logic capacity and memory while maintaining compliance with RoHS requirements.
Request a quote or submit a purchase inquiry for EP3SL110F780C4LN to receive pricing, availability, and lead-time details tailored to your project requirements.

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