EP3SL110F780I3

The EP3SL110F780I3 is a Stratix® III L field programmable gate array (FPGA) IC from Intel offered in a 780‑ball fine‑pitch BGA package. This industrial‑grade FPGA provides a large logic fabric and embedded memory suitable for designs that require significant programmable logic density and broad I/O capability.

With support for a core voltage range of 860 mV to 1.15 V and an operating temperature range from –40 °C to 100 °C, this device is targeted at applications that demand robust operation across extended temperature environments while remaining RoHS compliant.

Key Features

• Logic Capacity — Provides 107,500 logic elements to implement complex programmable logic and state machines.
• Embedded Memory — Approximately 4.99 Mbits of on‑chip RAM to support buffering, lookup tables, and memory‑dense algorithms.
• I/O Count — 488 user I/O pins to interface with parallel buses, serializers, or multiple peripherals.
• Package — 780‑BBGA, FCBGA package (supplier package: 780‑FBGA, 29×29) optimized for high pin‑count, surface‑mount board designs.
• Power — Core voltage range from 860 mV to 1.15 V to match modern low‑voltage system rails.
• Thermal and Environmental — Industrial operating temperature range of –40 °C to 100 °C and RoHS compliant.
• Mounting — Surface mount package suitable for automated assembly processes.

Typical Applications

• Industrial Control Systems — Implement custom control logic, sequencing, and interface bridging in industrial automation equipment, leveraging industrial temperature operation.
• High‑Density Logic Integration — Consolidate multiple logic functions into a single FPGA using the large pool of logic elements and on‑chip RAM.
• Data Acquisition and Processing — Use embedded RAM and abundant I/O for buffering and routing sensor or measurement data in embedded systems.
• Custom Interface and Protocol Bridging — Connect diverse peripherals and high‑pin‑count interfaces using the 488 available I/O pins.

Unique Advantages

• Large Logic Resource: 107,500 logic elements provide capacity for complex designs without immediate need for multiple devices.
• Significant On‑Chip Memory: Approximately 4.99 Mbits of embedded RAM reduces dependency on external memory for many buffering and lookup tasks.
• High I/O Count: 488 I/O pins enable direct interfacing to numerous peripherals, buses, and parallel interfaces, simplifying board-level routing.
• Industrial Temperature Range: Rated for –40 °C to 100 °C operation for deployment in temperature‑challenging environments.
• Compact, High‑Density Package: 780‑ball FBGA (29×29) supports high pin counts in a compact surface‑mount footprint for automated assembly.
• RoHS Compliant: Meets RoHS environmental requirements for reduced hazardous substances.

Why Choose EP3SL110F780I3?

The EP3SL110F780I3 combines substantial logic density, meaningful on‑chip memory, and a high I/O count in a compact 780‑BBGA package, making it well suited for industrial applications that require programmable logic with robust temperature capability. Its core voltage range and surface‑mount package support integration into modern low‑voltage embedded systems.

This device is a practical choice for engineers building systems that need scalable logic resources, ample embedded RAM, and extensive connectivity while maintaining industrial temperature performance and regulatory compliance.

Request a quote or submit an inquiry to obtain pricing, lead times, and availability for the EP3SL110F780I3.