EP3SL110F780I4

The EP3SL110F780I4 is an Intel Stratix® III L field programmable gate array (FPGA) supplied in a 780-ball BGA FCBGA package. It delivers a high logic density architecture suited to industrial applications that require extensive on-chip resources and a wide I/O complement.

With 107,500 logic elements, approximately 4.99 Mbits of embedded memory, and 488 general-purpose I/O, this device targets designs needing substantial programmable logic, significant embedded RAM capacity, and broad interfacing in a surface-mount 780-FBGA (29×29) package.

Key Features

• Core Logic  107,500 logic elements provide the capacity for complex digital designs and high-density logic implementation.
• Logic Block Count  4,300 logic array blocks offer a structured resource set for partitioning designs across fabric.
• Embedded Memory  Approximately 4.99 Mbits of on-chip RAM for data buffering, FIFOs, and local storage.
• I/O Density  488 I/O pins support extensive external interfacing for peripherals, sensors, and high-pin-count systems.
• Power Supply  Supports core voltage from 0.86 V to 1.15 V to match system power architectures and core requirements.
• Package & Mounting  Available in a 780-ball FBGA (29×29) surface-mount package (780-BBGA, FCBGA) for compact, board-level integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial-grade environments.
• Regulatory  RoHS-compliant construction supports restriction of hazardous substances requirements.

Typical Applications

• Industrial control and automation  Use the device’s industrial temperature rating, abundant I/O, and large logic capacity for sensor interfacing, motor control logic, and programmable automation controllers.
• High-density digital processing  Leverage 107,500 logic elements and nearly 5 Mbits of embedded RAM for complex signal processing tasks and custom datapath implementations.
• System integration platforms  The 780-FBGA package and high I/O count enable integration into compact, board-level systems that require dense routing and multiple peripheral interfaces.

Unique Advantages

• High logic capacity: 107,500 logic elements enable large, feature-rich designs without immediate need for multiple devices.
• Substantial embedded memory: Approximately 4.99 Mbits of on-chip RAM reduces reliance on external memory for buffering and local data storage.
• Extensive I/O: 488 I/O pins provide flexibility for connecting numerous peripherals, sensors, and interfaces.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in demanding environmental conditions.
• Compact surface-mount package: 780-FBGA (29×29) packaging balances high pin count with a compact board footprint for space-constrained designs.
• Low-voltage core operation: Core supply range from 0.86 V to 1.15 V enables compatibility with modern low-voltage power domains.

Why Choose EP3SL110F780I4?

The EP3SL110F780I4 positions itself as a high-density Stratix® III L FPGA option for industrial applications that require a large amount of programmable logic, significant embedded memory, and broad external connectivity. Its industrial temperature rating and RoHS compliance make it suitable for production deployments where environmental robustness and regulatory adherence matter.

Designers seeking a compact, surface-mount solution with 488 I/O and a 780-ball FBGA package will find the EP3SL110F780I4 offers a balance of integration and scalability across mid-to-large FPGA designs, backed by the Stratix III L family from Intel.

Request a quote or submit a procurement inquiry to receive pricing, availability, and assistance with integrating EP3SL110F780I4 into your next design.