EP3SL110F780I4LG

The EP3SL110F780I4LG is an Intel Stratix III family FPGA packaged in a 780-ball FCBGA intended for industrial applications. It delivers a high-density programmable fabric with a large number of logic elements, significant embedded RAM, and extensive I/O, making it suitable for high-performance logic, digital signal processing (DSP), and embedded system integration.

Built on the Stratix III architecture, the device offers selectable core voltage and programmable power features from the family to help balance performance and power consumption, while supporting on-chip security and reliability mechanisms described in the family datasheet.

Key Features

• Logic Density — 107,500 logic elements for implementing complex combinational and sequential designs.
• Embedded Memory — Approximately 4.99 Mbits of on-chip RAM to support buffers, FIFOs, and memory-intensive functions.
• I/O Capability — 488 user I/O pins in a modular bank structure to support a wide range of interfaces and external memory connections.
• Package & Mounting — 780-BBGA (780-FBGA, 29×29) surface-mount package for high-density board integration.
• Power and Core Voltage — Selectable core voltage operation with supply range from 0.860 V to 1.15 V to tune performance versus power.
• Operating Temperature — Industrial temperature grade rated from −40°C to 100°C for deployment in demanding environments.
• Security & Reliability (Family Features) — Family support for optional 256-bit AES configuration key and configuration CRC/ECC mechanisms for detecting and correcting configuration or memory errors.
• Clocking & PLLs (Family Features) — Family-level support includes multiple global/regional clocks and up to 12 PLLs for flexible clock management and synthesis.
• High-speed I/O & SERDES (Family Features) — Family support for high-speed differential I/O, SERDES, and dynamic alignment circuitry enabling high-throughput serial links.
• Standards & Interface Support (Family Features) — Family documentation lists support for common high-speed networking and memory interfaces, plus dedicated DQS logic on I/O banks for external memory timing.
• RoHS Compliant — Conforms to RoHS requirements for lead-free assembly and regulatory compliance.

Typical Applications

• High-performance DSP — Use the device’s large logic capacity and on-chip memory for signal processing pipelines, filtering, and real-time analytics.
• Embedded Compute & Acceleration — Implement custom hardware accelerators, protocol offload, or embedded logic alongside soft processors supported by the Stratix III family.
• Networking and Communications — Leverage high-speed I/O and SERDES-capable family features to implement serial links, protocol bridges, and interface controllers.
• Memory Interfaces — Support external memory interfaces and buffering using the device’s modular I/O and on-chip RAM for high-throughput memory systems.

Unique Advantages

• High Logic Capacity: 107,500 logic elements enable complex system integration and reduction of external components in the BOM.
• Substantial Embedded Memory: Approximately 4.99 Mbits of RAM supports large FIFOs, buffering, and state storage without external memory.
• Flexible Power Scaling: Selectable core voltage and family programmable power technology allow designers to optimize performance versus power consumption.
• Industrial Temperature Range: Rated −40°C to 100°C for deployment in industrial environments that require extended temperature operation.
• Extensive I/O: 488 user I/Os in a 780-FBGA package provide the connectivity needed for dense board-level integration and multiple external interfaces.
• Reliability and Security Features: Family-level AES configuration options, CRC, and ECC mechanisms help protect configuration and user memory integrity.

Why Choose EP3SL110F780I4LG?

The EP3SL110F780I4LG is positioned for designs that require a combination of high logic density, generous on-chip RAM, and broad I/O in an industrial-grade FPGA package. Its Stratix III family heritage brings selectable core voltage and family-level power and reliability features that help engineers tune systems for performance, power, and robustness.

This device is well suited for system designers implementing DSP-heavy algorithms, high-throughput interfaces, or embedded acceleration where on-chip resources and industrial temperature capability reduce system complexity and long-term maintenance risk.

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