EP3SL110F780I4L

The EP3SL110F780I4L is an Intel Stratix® III L field programmable gate array (FPGA) supplied in a 780-ball BGA (FCBGA) package. It delivers a large programmable fabric with 107,500 logic elements and approximately 4.99 Mbits of embedded memory for complex digital designs.

Designed for surface-mount installation, this industrial-grade device supports a wide operating temperature range (−40 °C to 100 °C), 488 user I/Os, and a core supply range of 860 mV to 1.15 V, enabling integration into thermally and electrically constrained systems.

Key Features

• Core FPGA Architecture  Stratix® III L family FPGA providing a high-density programmable logic fabric with 107,500 logic elements.
• Embedded Memory  Approximately 4.99 Mbits of on-chip RAM (total RAM bits: 4,992,000) for buffering, state storage, and algorithm acceleration.
• I/O Capacity  488 user I/Os to support extensive peripheral and subsystem interfacing requirements.
• Power Supply Range  Core voltage range from 860 mV to 1.15 V to match system power domains and regulator choices.
• Package & Mounting  780-ball BGA (FCBGA) package, supplier device package 780-FBGA (29×29), optimized for surface-mount assembly.
• Industrial Temperature Range  Qualified for operation from −40 °C to 100 °C for use in demanding environments.
• Regulatory Status  RoHS compliant.

Unique Advantages

• High logic capacity: 107,500 logic elements enable large-scale designs and complex custom logic implementations without external glue logic.
• Significant on‑chip memory: Approximately 4.99 Mbits of embedded RAM reduces dependence on external memory for many buffering and stateful functions.
• Robust I/O availability: 488 user I/Os provide flexibility for interfacing multiple peripherals, buses, and subsystems.
• Industrial operating envelope: −40 °C to 100 °C temperature rating supports deployment in temperature-sensitive and industrial environments.
• Compact package for dense boards: 780-BBGA (29×29) surface-mount package supports high pin count in a compact footprint for modern PCB layouts.
• Controlled core power range: 860 mV to 1.15 V supply range gives designers clear parameters for power delivery and thermal planning.

Why Choose EP3SL110F780I4L?

The EP3SL110F780I4L combines large logic capacity, multi-megabit embedded memory, and extensive I/O in a single industrial-grade BGA package, making it a strong choice for applications that require significant programmable logic resources within defined thermal and power constraints. Its specification set supports system-level integration where on-chip memory and high I/O count can reduce board-level complexity.

Specification-driven customers and engineering teams will find this device suitable when their designs demand scalability of logic resources, substantial embedded RAM, and operation across a wide temperature range—all backed by Intel's Stratix® III L architecture.

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